Thermal Management for Tightly Integrated Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Tightly integrated semiconductor devices, such as System in Package (SiP) and System on Glass (SoG), face thermal management challenges due to differing operating temperature tolerances among stacked dice, where heat from one die can exceed the tolerance of adjacent dice, leading to shutdowns and inefficiencies, as current methods rely solely on individual temperature regulation without considering inter-die heat transfer.
Innovation Solution
Incorporating a leakage sensor to measure the leakage current of one die and a thermal management unit that controls the temperature of adjacent dice by adjusting their activity based on the leakage current and thermal tolerance, using techniques like Dynamic Voltage and Frequency Scaling (DVFS), Dynamic Frequency Scaling (DFS), clock gating, and power collapsing to manage heat distribution across the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each die regulates its own operation based on its own temperature tolerance, then each die can maintain its operating temperature, but heat from one die may exceed the tolerance of adjacent dice causing shutdowns
Solution Approach 1:
The patent implements a feedback mechanism where temperature sensors monitor the temperature of each die, and the thermal management unit receives this information to dynamically adjust the operation of heat-generating dice. When a die approaches its temperature tolerance limit, the system reduces its activity to prevent exceeding the limit, thereby maintaining operational stability while accounting for inter-die heat transfer.
Solution Approach 2:
The patent introduces a thermal management unit as an intermediary component that coordinates thermal regulation across multiple dice. This unit receives temperature information from sensors on different dice and controls the operation of heat-generating dice based on the thermal state of temperature-sensitive dice, acting as a mediator to balance thermal requirements across the stacked package.
2Reliability
If thermal sensors are added to monitor temperature, then temperature regulation can be improved, but valuable space in the tightly integrated device is consumed
Solution Approach 1:
The patent makes temperature sensors multi-functional by using them not only for temperature monitoring but also for detecting leakage current through their electrical characteristics. This allows the same sensor structure to serve dual purposes: thermal monitoring and leakage detection, thereby improving temperature regulation without consuming additional space in the tightly integrated device.
Solution Approach 2:
The patent enables temperature sensors to self-diagnose their operational status by monitoring their own leakage current characteristics. When a sensor approaches its temperature limit, changes in its leakage current provide feedback about its thermal state, allowing the system to regulate temperature based on sensor self-reporting without requiring separate monitoring circuits.
3Productivity
If the processor operates at high temperature near its tolerance range, then processing performance is maintained, but adjacent memory dice must shut down due to excessive heat
Solution Approach 1:
The patent implements dynamic thermal management where the operation of the processor and memory dice is continuously adjusted based on real-time temperature conditions. When memory dice approach their temperature tolerance, the system dynamically reduces processor activity to lower heat generation, ensuring memory continues operating within its tolerance range while maintaining overall system productivity through adaptive resource allocation.
Solution Approach 2:
The patent changes operational parameters (such as clock frequency, voltage, or activity level) of heat-generating dice based on the thermal state of temperature-sensitive dice. When memory temperature approaches its limit, the processor operates at reduced parameters to decrease heat output, allowing the memory to remain within its operational temperature range while the processor maintains acceptable performance levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively regulates the temperature across dice, preventing shutdowns and enhancing thermal management by dynamically adjusting the activity of dice based on measured leakage currents and tolerances, thereby improving the operational stability and efficiency of tightly integrated semiconductor devices.
Implementation Method 1
a leakage sensor to measure the leakage current of one die
Implementation Method 2
the thermal management unit is configured to control a temperature of the first die by controlling heat emanating from the second die
Implementation Method 3
controlling the heat emanating from the second die includes reducing activity of the second die
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
Some implementations provide a semiconductor package that includes a first die and a second die adjacent to the first die. The second die is capable of heating the first die. The semiconductor package also includes a leakage sensor configured to measure a leakage current of the first die. The semiconductor package also includes a thermal management unit coupled to the leakage sensor. The thermal management unit configured to control a temperature of the first die based on the leakage current of the first die.