Thermal Mask for Light Soldering Heat Management
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Solution Overview
Problem
Existing semiconductor device manufacturing methods face challenges in preventing thermal damage to semiconductor devices and ensuring the longevity of manufacturing facilities, particularly due to inadequate heat dissipation during soldering processes.
Innovation Solution
A method involving a mask with distinct thermal conductivity areas is used, where a substrate with a solder paste is positioned on the mask, and a light soldering process is applied, utilizing a light source to selectively heat the solder paste while dissipating excess heat through areas with varying thermal conductivities, preventing damage to non-mounting areas and efficiently soldering components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a light soldering process is performed by emitting light on the substrate from a light source above the substrate, then soldering efficiency is improved, but thermal damage to the semiconductor device may occur due to excessive heat
Solution Approach 1:
The mask is divided into multiple regions with different thermal conductivities: a first region with high thermal conductivity positioned under the non-mounting area to dissipate heat and prevent thermal damage, and a second region with low thermal conductivity positioned under the mounting area to concentrate heat for effective soldering. This segmentation allows different parts of the mask to perform different thermal functions simultaneously.
Solution Approach 2:
Different regions of the mask are assigned different thermal conductivity properties tailored to their specific functions. The first region under the non-mounting area has high thermal conductivity to quickly conduct away excess heat, while the second region under the mounting area has low thermal conductivity to retain heat and facilitate soldering. This local differentiation of material properties optimizes both heat dissipation and heat concentration in their respective zones.
2Manufacturing precision
If heat is concentrated on the mounting area for effective soldering, then soldering quality is improved, but the lifespan of manufacturing facilities may be reduced due to excessive heat exposure
Solution Approach 1:
The mask is segmented into functional zones that manage heat distribution: the second region with low thermal conductivity under the mounting area concentrates heat to ensure high-quality soldering, while the first region with high thermal conductivity dissipates excess heat to protect the facility. This segmentation enables simultaneous optimization of soldering quality and facility durability.
Solution Approach 2:
The mask acts as an intermediary thermal management layer between the light source and the substrate. It selectively transmits and blocks heat to different areas, mediating the thermal energy distribution to achieve both effective soldering on the mounting area and heat dissipation to protect the facility structure from excessive heat exposure.
3Temperature
If a mask with varying thermal conductivities is used, then heat control is improved, but device complexity increases
Solution Approach 1:
The mask is divided into distinct regions with different thermal conductivities to achieve precise heat control. The first region has high thermal conductivity for heat dissipation, while the second region has low thermal conductivity for heat concentration. This segmentation provides effective thermal management while maintaining a relatively simple overall mask structure.
Solution Approach 2:
Different regions of the mask possess different thermal conductivity properties localized to their specific functional requirements. This local differentiation of material properties enables precise temperature control in different areas without requiring a completely complex mask design, as each region is optimized for its specific thermal role.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents thermal damage to semiconductor devices and extends the lifespan of manufacturing facilities by ensuring controlled heat dissipation and efficient soldering, reducing the risk of overheating and equipment degradation.
Implementation Method 1
A light soldering process is performed by emitting light on the substrate from a light source above the substrate
Implementation Method 2
The first area of the mask is positioned under the non-mounting area and the second area of the mask is positioned under the mounting area
Data Source
AI summary
A method of manufacturing a semiconductor device includes arranging a mask on a support. The mask includes a first area and a second area. A substrate is arranged on the mask. The substrate has a mounting area and a non-mounting area. A solder paste is applied on the mounting area of the substrate. After applying the solder paste, at least one electronic device is arranged on the mounting area. A light soldering process is performed by emitting light on the substrate from a light source above the substrate. The first area of the mask is positioned under the non-mounting area and the second area of the mask is positioned under the mounting area.