Thermal Memory Packer Sub for Annular Debris Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Packing devices often accumulate debris in the annulus between the packer and the casing, making it difficult to unset and move them within the wellbore, as the debris can cause the packer to become stuck.
Innovation Solution
A packer system incorporating thermal memory subs made of memory shape materials that change outer diameter with temperature, reducing debris accumulation during treatment and facilitating easy movement by adjusting the annular area between the packer and the casing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the packer maintains a constant outer diameter, then the sealing effectiveness is maintained, but debris accumulates in the annulus causing the packer to become stuck
Solution Approach 1:
The packer employs dynamic diameter adjustment through shape memory alloy subs that can change their outer diameter based on temperature conditions. During treatment, the subs expand to reduce annular space and prevent debris accumulation. During retrieval, they contract to increase clearance and facilitate movement, thus resolving the contradiction between maintaining sealing effectiveness and ensuring ease of movement.
Solution Approach 2:
The invention changes the physical parameter of the packer's outer diameter by utilizing shape memory alloy materials that respond to temperature changes. The subs transition between expanded and contracted states based on thermal conditions, allowing the packer to adapt its diameter to different operational phases (treatment vs. retrieval) and eliminate the trade-off between sealing and mobility.
2Object-generated harmful factors
If the annular area between packer and casing is reduced during treatment, then debris accumulation is minimized, but the packer becomes difficult to unset and move
Solution Approach 1:
The packer system dynamically adjusts the annular area through temperature-responsive shape memory alloy subs. During treatment operations, the subs expand to minimize the annular space, reducing debris accumulation. During unset and movement operations, the subs contract to maximize annular clearance, facilitating smooth movement. This dynamic adjustment eliminates the need to choose between preventing debris accumulation and ensuring ease of movement.
3Ease of manufacture
If the packer is designed with fixed dimensions, then manufacturing is simplified, but the packer cannot adapt to different operational conditions
Solution Approach 1:
The invention incorporates shape memory alloy materials into the packer's sub components, creating a composite structure that combines conventional materials with smart materials. These shape memory alloys provide temperature-responsive dimensional changes, enabling the packer to adapt its outer diameter to different operational conditions (treatment vs. retrieval) while maintaining relatively simple manufacturing processes for the overall assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces debris accumulation during treatment by expanding the annular area at higher temperatures and reduces the risk of the packer becoming stuck by enlarging it when unsetting, allowing for smoother relocation.
Implementation Method 1
At a first temperature the first sub has a first outer diameter and at a second temperature the first sub has a second outer diameter, the second outer diameter being larger than the first outer diameter
Implementation Method 2
the first sub being comprised of a memory shape material... The memory shape alloy may be nickel titanium alloy, nickel titanium zirconium alloy, titanium nickel copper alloy
Data Source
AI summary
A packer having a thermal memory spacing system that includes a portion of the system that that selectively changes an outer diameter due. The packer may include upper and lower sealing elements, and at least one thermal memory shape material sub positioned between the sealing elements. The thermal memory shape material sub may have a first outer diameter at a first temperature and a second larger outer diameter at a second temperature. The first temperature may be greater than the second temperature. The outer diameter of the sub may be selectively increased to temporarily decrease the annular area in which debris and/or materials may collect and potentially cause the packer to become stuck within the wellbore. Prior to moving the packer to a different location, the outer diameter of the sub may be decreased to increase the annular area.


