Thermal Model Element Layer Calibration via Structure Function
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Solution Overview
Problem
Current thermal analysis methods, such as thermocouples, are prone to errors and inadequately reproducible due to temperature distribution issues and inability to measure internal structure temperatures, making them ineffective for calibrating thermal models of electronic packages.
Innovation Solution
A method involving thermal transient response simulations to determine structure function feature correlations with thermal model element layers by varying thermal resistance values and associating portions of the structural function with these elements, allowing for accurate calibration of thermal models.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If thermocouples are used to measure temperature, then temperature measurement is achieved, but measurement precision deteriorates due to temperature distribution issues and inability to measure internal structure temperatures
Solution Approach 1:
The patent replaces physical thermocouple measurement with thermal transient response simulation. Instead of using mechanical/physical contact sensors that introduce errors, the invention uses computational simulation to predict temperature distribution and thermal resistance, thereby achieving higher measurement precision and reliability without physical interference
Solution Approach 2:
The patent introduces thermal structure function as an intermediary between the physical thermal system and the measurement objective. By simulating the thermal transient response and extracting structure function features, the invention indirectly obtains accurate thermal resistance values without direct physical measurement that causes errors
2Measurement precision
If thermal transient response simulation is performed to identify thermal model elements, then measurement precision improves, but device complexity increases due to multiple simulations and data processing
Solution Approach 1:
The patent segments the thermal model into discrete thermal model elements (TMEs) representing different physical structures. By dividing the continuous thermal system into discrete segments, the simulation can efficiently identify and characterize each element's contribution to the overall thermal response, reducing computational complexity while maintaining precision
Solution Approach 2:
The patent transforms the thermal transient response data into structure function domain by changing parameters (from time-domain temperature response to resistance-capacitance domain structure function). This parameter transformation simplifies the identification process by making the contribution of each thermal model element more distinguishable and easier to extract
Data Source
AI summary
A thermal transient response simulation is performed to determine a total thermal resistance value for a structure having a plurality of thermal model elements. A plurality of thermal transient response simulations are also performed for the structure to determine changed total thermal resistance values by varying one of thermal resistance values of the thermal model elements. Thermal resistance values for the thermal model elements are then determined based on the total thermal resistance value and the changed total thermal resistance values. The structure function is divided into portions associated with the thermal model elements based on the thermal resistance values for the thermal model elements.