Thermal Module With Inter-Chamber Capillary Bridge
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Solution Overview
Problem
Conventional thermal modules, such as vapor chambers, face challenges in efficiently transferring heat to remote areas due to limited heat dissipation capabilities, leading to overheating and potential malfunction in ultra-thin electronic devices with increased thermal flux.
Innovation Solution
A thermal module comprising a first vapor chamber with a capillary structure and a second heat pipe with a conduction section and an additional capillary structure on its outer surface, filled with a working fluid, enhancing both large-area and remote end heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional vapor chamber is used for heat dissipation, then large-area heat transfer is achieved, but heat cannot be effectively transferred to remote ends
Solution Approach 1:
The thermal module is divided into multiple functional components: a vapor chamber for large-area heat transfer and heat pipes for remote end heat dissipation. This segmentation allows each component to specialize in its strength, resolving the contradiction between large-area transfer and remote end effectiveness.
Solution Approach 2:
The invention merges a vapor chamber with heat pipes into a single integrated thermal module. The vapor chamber provides large-area heat transfer while the heat pipes extend heat dissipation to remote ends, combining the advantages of both structures to overcome their individual limitations.
2Strength
If heat pipe and vapor chamber are welded together, then structural connection is achieved, but thermal resistance increases at welding sections
Solution Approach 1:
A third capillary structure is introduced as an intermediary between the vapor chamber and heat pipe, filled with working fluid to create a thermal bridge. This intermediary connection maintains structural integrity while providing a low thermal resistance path for heat transfer, avoiding the thermal resistance problem of welding.
Solution Approach 2:
The connection between vapor chamber and heat pipe uses working fluid in capillary structures instead of direct metal welding. The fluid-filled capillary connection provides both mechanical support and thermal conduction, eliminating welding-induced thermal resistance while maintaining structural strength.
3Productivity
If miniaturization of semiconductors is pursued, then performance is improved, but thermal flux increases causing overheating
Solution Approach 1:
The thermal module extends heat dissipation from a two-dimensional plane (vapor chamber surface) to three-dimensional space by incorporating heat pipes that conduct heat to remote ends. This dimensional expansion provides additional heat dissipation pathways, managing thermal flux from miniaturized high-performance components.
Solution Approach 2:
Different regions of the thermal module have specialized functions: the vapor chamber provides uniform heat distribution across the chip area, while heat pipes concentrate and transport heat to specific remote dissipation points. This local specialization allows efficient management of thermal flux from miniaturized components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal module achieves improved heat dissipation efficiency by effectively transferring heat over a larger area and to remote locations, reducing the risk of overheating in electronic devices.
Implementation Method 1
a first capillary structure in the first chamber, a second capillary structure in the second chamber, and a third capillary structure on the outer surface of the conduction section
Implementation Method 2
A working fluid is respectively filled in the first and second chambers
Implementation Method 3
The working fluid is filled in the vapor chamber to perform vapor-liquid circulation between the evaporation section and the condensation section
Implementation Method 4
The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section
Data Source
AI summary
A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.