Thermal Module Capillary Joining for Wick-Safe Hermetic Sealing
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Solution Overview
Problem
Existing thermal modules face issues such as compromised performance due to damage to wick structures during formation processes or increased size and reduced thermal transport performance due to the addition of flanges, leading to space constraints in electronic devices.
Innovation Solution
The use of divergent walls in thermal modules to create capillary forces that draw a bonding paste between them, forming a structural joint and hermetic seal while avoiding contact with internal wick structures, thereby maintaining thermal efficiency and reducing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal part is bent or deformed from a circular cross section to a desired cross sectional shape, then the thermal module can be formed, but the wick structures positioned along an inner surface of the metal are damaged, resulting in compromised performance
Solution Approach 1:
The thermal module is divided into multiple separate pieces that are joined together using flanges, avoiding the need to deform a single-piece structure that would damage wick structures during bending or deformation processes
Solution Approach 2:
Flanges are added to the pieces before joining, allowing the components to be assembled in a predetermined configuration that protects internal wick structures from deformation damage while maintaining structural integrity
2Strength
If flanges are added to a multi-piece thermal module to join pieces together, then the pieces can be securely connected, but the thermal module size increases and thermal transport performance decreases
Solution Approach 1:
Joining features are localized to specific regions of the component geometry, allowing strong connections to be formed only where necessary while maintaining minimal overall size and preserving thermal transport performance in the bulk of the structure
3Strength
If flanges are added to a multi-piece thermal module, then the pieces can be joined together, but the thermal module occupies additional space within an electronic device
Solution Approach 1:
Joining features are integrated into the minimal necessary geometry of the components, providing adequate connection strength while minimizing the overall footprint and space occupation within the electronic device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the contact surface area between walls, removes impurities and bubbles, and provides a strong, hermetic seal, ensuring effective heat transport without damaging wick structures and minimizing device space requirements.
Implementation Method 1
the bonding paste is configured to: extend along the gap between the first wall and the second wall... based on a capillary force, cause the bonding paste to extend between a gap formed by the first wall and the second wall
Data Source
AI summary
A thermal module includes parts with diverging or divergent walls that cause a capillary pressure gradient in a bonding paste used to secure the parts together. Based in part on the capillary pressure, the bonding paste is drawn in between the divergent walls, including small gaps between the walls. Additionally, during a reflow operation of the bonding paste, particles and/or air bubbles can egress from the bonding paste, allowing the bonding paste to freeze and form a homogeneous structure. By removing particles and air bubbles, the bonding paste can form a more robust structural joint and a hermetic seal for the thermal module. The multiple parts of the thermal module can be formed into their respective shapes prior to be joined together by the bonding paste. As a result, the formation of the thermal module is less likely to damage other structures, such as wick structures.