Thermal Module With Conduction Section Capillary Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thermal modules, such as vapor chambers, face challenges in efficiently transferring heat to remote areas due to limited heat dissipation capabilities, leading to overheating and potential malfunction in ultra-thin electronic devices with increased thermal flux.
Innovation Solution
A thermal module comprising a first heat transfer member with a capillary structure and a second heat transfer member with a conduction section, where a third capillary structure is disposed on the outer surface of the conduction section, enhancing heat transfer efficiency by allowing both large-area and remote end heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional vapor chamber is used for heat dissipation, then large-area heat transfer is achieved, but remote end heat transfer capability is insufficient
Solution Approach 1:
The thermal module is divided into multiple functional components: a first vapor chamber for large-area heat absorption, a heat conduction section for directional heat transport, and a second vapor chamber for remote heat dissipation. This segmentation allows each component to specialize in specific heat transfer tasks, resolving the contradiction between large-area transfer and remote end capability.
Solution Approach 2:
The heat conduction section acts as an intermediary component between the two vapor chambers. It receives heat from the first vapor chamber and efficiently conducts it to the second vapor chamber, enabling remote heat transfer while maintaining the large-area heat absorption capability of the first chamber.
2Volume of moving object
If semiconductors are miniaturized to improve device thinness, then device thickness is reduced, but thermal flux increases causing overheating
Solution Approach 1:
The invention utilizes phase change of working fluid (vapor-liquid transition) within the closed vapor chamber system to transfer heat. The working fluid absorbs heat as vapor in the evaporation section and releases heat as liquid in the condensation section, providing efficient thermal management for miniaturized devices with high thermal flux.
Solution Approach 2:
The vapor chamber employs phase transition of the working fluid between liquid and vapor states to achieve efficient heat absorption and release. This phase change mechanism enables high heat transfer efficiency in a compact structure, addressing the thermal management challenges of miniaturized electronic devices.
3Reliability
If heat pipe and vapor chamber are welded together for heat dissipation, then heat transfer path is established, but thermal resistance is introduced at welding sections
Solution Approach 1:
The heat conduction section is integrated with both vapor chambers through direct contact or bonding, forming a unified thermal management system. This merging approach eliminates the need for separate welding joints between heat pipe and vapor chamber, reducing thermal resistance at connection interfaces while maintaining continuous heat transfer paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal module achieves improved heat dissipation efficiency by enabling effective heat transfer to remote areas, preventing overheating and ensuring reliable operation of ultra-thin electronic devices.
Implementation Method 1
a first capillary structure is disposed in the first chamber. A second capillary structure is disposed in the second chamber. A third capillary structure is disposed on outer surface of the conduction section
Implementation Method 2
The working fluid is filled in the first and second chambers to perform vapor-liquid circulation between the evaporation section and the condensation section
Implementation Method 3
The second heat transfer member has a second chamber and a conduction section. The conduction section is received in the first chamber
Data Source
AI summary
A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.