Thermal Module Direct Cooling Chip Integration
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Solution Overview
Problem
Conventional thermal modules have a complex structure, poor heat dissipation efficiency, and fail to directly dissipate heat generated by the heat source due to the cooling chip not being in direct contact with the heat exchanger, leading to limited heat dissipation effects.
Innovation Solution
A thermal module design featuring a cooling chip in direct contact with both the heat radiating unit and the heat dissipating element, allowing for direct cooling and a simplified structure, which includes a heat dissipating element with a heat-radiating face and a cooling chip with a hot and cold end, along with a heat radiating unit that includes a heat sink and heat pipes for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional water-cooling thermal module is used with multiple heat dissipating units and water pipes, then the structure can dissipate heat, but the structure becomes complicated and heat dissipation efficiency is poor
Solution Approach 1:
The patent merges the heat dissipating element and heat radiating unit into a single integrated assembly with the cooling chip positioned between them. This integration eliminates the need for separate water-cooling components (pump, water pipes, multiple heat dissipating units), thereby simplifying the overall structure while maintaining effective heat dissipation through direct thermal contact paths.
Solution Approach 2:
The patent extracts and eliminates unnecessary intermediate components from the conventional water-cooling system. By removing the pump, water pipes, and complex fluid circulation system, the invention achieves direct thermal coupling between the heat source, cooling chip, and heat radiating unit, significantly improving heat dissipation efficiency while reducing structural complexity.
2Loss of energy
If the cooling chip is not in direct contact with the heat exchanger, then the structure can be simpler, but the heat dissipation effect is limited
Solution Approach 1:
The cooling chip serves as an intermediary thermal conductor positioned in direct contact with both the heat dissipating element and the heat radiating unit. This intermediary component establishes an efficient thermal pathway that enables direct heat transfer from the heat source through the cooling chip to the radiating fins, achieving superior heat dissipation effect while maintaining structural simplicity.
3Loss of energy
If multiple heat dissipating units and water pipes are used, then heat can be dissipated, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated thermal module comprising the heat dissipating element, cooling chip, and heat radiating unit. This merger eliminates the need for separate manufacturing and assembly of pump, water pipes, and multiple heat dissipating units, thereby reducing manufacturing complexity and cost while preserving effective heat dissipation capability.
4Loss of energy
If a conventional water-cooling system with pump and water pipes is used, then heat can be dissipated, but the assembly becomes difficult
Solution Approach 1:
The patent extracts and removes the pump and water pipe components from the conventional water-cooling system. By eliminating these complex fluid circulation components, the invention reduces the number of parts requiring assembly, simplifies the assembly process, and lowers assembly difficulty while maintaining effective heat dissipation through direct thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in improved heat dissipation efficiency, reduced manufacturing costs, a compact design, and easier assembly, while providing an upgraded heat dissipation effect by allowing direct cooling of the heat dissipating element.
Implementation Method 1
The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit
Implementation Method 2
a heat radiating unit that includes a heat sink and heat pipes for enhanced heat transfer
Implementation Method 3
heat radiating unit that includes a heat sink and heat pipes for enhanced heat transfer
Data Source
AI summary
A thermal module includes at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. With the cooling chip in direct contact with the heat radiating unit and the heat dissipating element, the heat dissipating element can be directly cooled by the cooling chip, and the thermal module can have a simplified structure to occupy a reduced room while providing enhanced heat dissipating efficiency and accordingly upgraded heat-dissipating effect.