Thermal Module Assembly Using Copper-Embedded Aluminum Interfaces
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Solution Overview
Problem
Conventional thermal module manufacturing methods face challenges in welding aluminum and copper materials due to oxidation, eutectic structure formation, and environmental pollution from chemical nickel plating, leading to weight, cost, and connectivity issues.
Innovation Solution
A copper embedding layer is applied to aluminum heat dissipation components using physical or chemical processing to facilitate secure welding with copper components, replacing chemical nickel plating and reducing environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If copper material is replaced with aluminum material to reduce weight and cost, then weight and material cost are reduced, but welding difficulty increases due to oxidation and eutectic structure formation
Solution Approach 1:
The patent introduces a copper embedding layer as an intermediary between aluminum and copper components. This intermediate copper layer mediates the welding process by providing a copper-copper bonding interface that avoids the problematic aluminum-copper direct weld, eliminating oxidation and eutectic structure issues while enabling successful welding of aluminum to copper assemblies.
2Ease of manufacture
If chemical nickel plating is used to modify aluminum surface for welding, then welding compatibility is improved, but environmental pollution increases due to toxic waste liquid containing yellow phosphorus
Solution Approach 1:
The patent extracts and eliminates the harmful chemical nickel plating process from the manufacturing sequence. Instead of applying a nickel coating that requires toxic chemical baths, the invention uses a copper embedding layer formed through physical or non-toxic chemical processes, thereby removing the source of yellow phosphorus waste and other toxic byproducts from the production process.
Solution Approach 2:
The copper embedding layer serves as a functional replacement for the nickel plating coating, providing the necessary welding compatibility without the environmental burden. This approach uses a simpler, more environmentally friendly material system that achieves the same technical objective without generating persistent toxic waste.
3Device complexity
If copper and aluminum are directly welded, then assembly process is simplified, but welding quality deteriorates due to fissure, pores, and eutectic structure formation
Solution Approach 1:
The patent applies preliminary action by forming the copper embedding layer on the aluminum surface before the welding operation. This pre-treatment modifies the aluminum surface to be more compatible with copper welding, preventing oxidation and eutectic structure formation during the subsequent welding process, thereby ensuring high welding quality without increasing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper embedding layer enables successful welding and connection of aluminum and copper components without environmental pollution, reducing weight and cost while improving thermal module assembly efficiency.
Implementation Method 1
disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component
Implementation Method 2
welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component
Data Source
AI summary
A manufacturing method of thermal module includes steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component. By means of the copper embedding layer, the aluminum heat conduction component can be welded and connected with other heat conduction components made of heterogeneous materials and the same material.