Thermal Module Structure With Copper Embedding Weld Interface

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Solution Overview

Problem

The direct welding of copper and aluminum metal materials is hindered by the formation of aluminum oxide, brittleness, and differences in melting points, leading to difficulties in forming strong bonds without surface modification.

Innovation Solution

The use of copper embedding layers on the aluminum base and other components allows for direct welding of dissimilar metal materials, such as copper heat pipes and aluminum bases, without the need for electroless nickel plating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electroless nickel plating is applied to aluminum surfaces before welding, then welding between aluminum and copper becomes feasible, but manufacturing cost increases and environmental pollution occurs due to toxic chemicals

Engineering Contradiction:
Improvewelding bond strengthVSAvoidmanufacturing cost and environmental impact
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The invention extracts and removes the electroless nickel plating process from the manufacturing flow. Instead of plating aluminum surfaces with nickel before welding, the patent directly welds aluminum to copper after simple surface treatment, eliminating the need for toxic chemicals and complex plating equipment while maintaining welding quality

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces a copper embedding layer as an intermediary between aluminum and copper components. This copper layer serves as a transition zone that facilitates welding between dissimilar metals without requiring nickel plating, thereby reducing manufacturing complexity and environmental impact

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If direct welding is attempted between aluminum and copper without surface modification, then manufacturing cost is reduced, but welding fails due to aluminum oxide formation and brittleness

Engineering Contradiction:
Improvemanufacturing costVSAvoidwelding bond strength
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention performs preliminary surface treatment of aluminum surfaces before welding, including removal of aluminum oxide layers and application of copper embedding layers. This preliminary preparation enables subsequent direct welding without requiring expensive and environmentally harmful nickel plating

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The copper embedding layer acts as an intermediary substance that bridges aluminum and copper materials. It is applied to aluminum surfaces before welding, creating a transition zone that allows successful welding between dissimilar metals while avoiding the need for nickel plating

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables cost-effective manufacturing while ensuring environmental protection by eliminating the use of toxic chemicals associated with electroless nickel plating, and addresses material shortages and bonding issues.

Implementation Method 1

the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials all can be directly connected to the aluminum base by welding without the need of electroless nickel plating

Methodology Applied
Scientific EffectWelding: Welding

Implementation Method 2

The copper heat pipes respectively have a heat absorption end received in a groove sunken into a lower surface of the aluminum base, and a heat dissipation end extended from the heat absorption end

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 3

copper metal material has the feature of high efficiency of heat conduction, it is often selected for making a heat dissipation base of the heat sink or the heat dissipation device to exchange heat with heat-producing execution units

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12215934B2Thermal module structure
Publication Date: 2025.02.04 ASIA VITAL COMPONENTS CO LTD
  • US12215934B2 patent drawing
  • US12215934B2 patent drawing
  • US12215934B2 patent drawing

AI summary

A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.