Integrated Thermal Module With In-Die Inductor and Heat Sink
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Solution Overview
Problem
Existing electronic component packages face challenges in efficiently dissipating heat due to the presence of discrete inductors, which complicate component routing, require significant space, and can cause electromagnetic interference.
Innovation Solution
An integrated module with a thermal network is introduced, featuring a heat sink structure and an integrated inductor, where the heat sink structure extends from the circuit die with a distal surface for heat dissipation, and a molding material covers the inductor and heat sink to enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If discrete inductors are used in electronic component packages, then electromagnetic compatibility can be improved through separate component placement, but device complexity increases due to complex routing requirements and space constraints
Solution Approach 1:
The patent integrates the inductor directly into the circuit die, merging two previously separate components (inductor and circuit die) into a single integrated structure. This eliminates the need for complex external routing and component placement while maintaining electromagnetic compatibility through controlled integration of magnetic elements within the die structure.
2Object-affected harmful factors
If discrete inductors are used to meet clearance and spacing requirements, then electromagnetic compatibility is improved, but the package area increases due to space restrictions and bulky components
Solution Approach 1:
By integrating the inductor onto the circuit die rather than using discrete components, the patent significantly reduces the overall package area. The inductor structure is formed using the same semiconductor fabrication processes as the circuit, allowing both components to share the same substrate space and eliminating the need for additional clearance and spacing that would be required for discrete inductors.
3Temperature
If heat sink structure extends from circuit die for heat dissipation, then temperature control is improved, but device complexity increases due to additional structural components
Solution Approach 1:
The heat sink structure is integrated directly with the circuit die as a unified thermal management system. The heat sink extends from the rear surface of the die and works in conjunction with the front surface circuitry, creating a complete thermal pathway that dissipates heat efficiently without requiring separate, complex thermal management components.
4Reliability
If molding material covers the heat sink structure, then mechanical protection is improved, but heat dissipation capability may be reduced due to material coverage
Solution Approach 1:
The molding material is selectively applied to cover only specific portions of the heat sink structure, leaving the distal surface and other critical heat dissipation areas exposed. This localized coverage provides mechanical protection where needed while maintaining thermal pathways and surface area for effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated module effectively dissipates heat through a distal surface, reducing electromagnetic interference and optimizing space utilization, thereby maintaining optimal circuit performance and reliability.
Implementation Method 1
a heat sink structure formed over the second surface of the electronic circuit die, the heat sink structure comprising at least one side portion extending from the second surface of the electronic circuit die and a distal surface relative to the electronic circuit die via at least the distal surface
Implementation Method 2
the heat sink structure comprising at least one side portion extending from the second surface of the electronic circuit die and a distal surface relative to the electronic circuit die to dissipate heat from the electronic circuit die via at least the distal surface
Data Source
AI summary
One example includes an electronic circuit package. The electronic circuit package includes a lead frame. The electronic circuit package includes an electronic circuit die disposed on the lead frame. The electronic circuit package includes an integrated inductor. The electronic component package includes a heat sink structure to provide a thermally conductive path for heat to rise to the distal surface of the electronic component package in relation to the electronic circuit die. The electronic component package includes a molding material that provides additional thermal conductivity for the electronic component package in relation to the electronic circuit die.