Thermal Module With Segmented Compartments For Non-Uniform Heat Dissipation

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Solution Overview

Problem

Existing thermal solutions for electronic components face challenges in efficiently dissipating non-uniformly distributed heat, as vapor chambers and heat pipes are limited in their ability to handle heat distribution across the surface of high-power components with varying heat densities.

Innovation Solution

A thermal module with multiple independent compartments connected to heat pipes, allowing for independent vapor-liquid circulations and enhanced heat transfer capabilities, combining the heat spreading function of vapor chambers with the remote end heat transfer function of heat pipes, thereby increasing the capacity for heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a vapor chamber is used for heat dissipation, then two-dimensional heat transfer is achieved, but the heat transfer efficiency for non-uniformly distributed heat sources is insufficient

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidheat transfer mechanism complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The housing is divided into multiple independent compartments (first compartment, second compartment, third compartment, fourth compartment) that are spatially separated and independently filled with working fluid. Each compartment can independently perform vapor-liquid circulation, allowing parallel heat transfer operations that increase overall heat dissipation efficiency without requiring complex inter-compartment heat transfer mechanisms.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from traditional two-dimensional heat transfer (vapor chamber) to a three-dimensional configuration by adding multiple vertically stacked compartments. This dimensional expansion allows heat to be transferred both horizontally within compartments and vertically between compartments through the heat pipe, creating a multi-directional heat transfer pathway that better addresses non-uniform heat distribution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If a heat pipe is used for heat dissipation, then one-dimensional heat transfer is achieved, but the heat spreading capability is limited

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidheat spreading area
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The invention merges the heat pipe structure with multiple vapor chamber compartments into a hybrid thermal module. The heat pipe serves as both a one-dimensional heat transfer conduit and a structural support for multiple compartments, combining the advantages of both heat pipe (efficient heat conduction) and vapor chamber (heat spreading) technologies in a unified structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat pipe chamber serves multiple functions: it acts as a heat conduction pathway, provides structural support for the compartments, and serves as a reservoir for working fluid. The independent compartments simultaneously function as heat absorption zones and vapor-liquid circulation chambers, creating a multi-functional thermal management system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If multiple independent compartments are used to handle non-uniform heat distribution, then heat dissipation effectiveness is improved, but the device complexity increases

Engineering Contradiction:
Improveheat dissipation effectivenessVSAvoidcompartment structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The housing is divided into multiple independent compartments (first compartment, second compartment, third compartment, fourth compartment) that are spatially separated and independently filled with working fluid. Each compartment can independently perform vapor-liquid circulation, allowing parallel heat transfer operations that increase overall heat dissipation efficiency without requiring complex inter-compartment heat transfer mechanisms.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each compartment is independently filled with working fluid and can be optimized for specific heat transfer requirements. The partitioning board creates distinct thermal zones that can handle different heat densities locally, allowing the system to adapt to non-uniform heat distribution patterns without requiring complex overall system redesign.

Inventive Principle:
Principle #3Local quality

4Temperature

If the capacity of working fluid is increased to maximize heat transfer, then heat transfer capability is improved, but the volume of the thermal module increases

Engineering Contradiction:
Improveheat transfer capabilityVSAvoidthermal module volume
Core Design Contradiction:
TemperatureVSVolume of stationary object

Solution Approach 1:

The multiple compartments are nested within the housing structure, with each compartment occupying a defined spatial region. The partitioning board efficiently divides the internal volume while minimizing wasted space. This nested arrangement allows maximum working fluid capacity within a compact footprint, as each compartment is tightly integrated into the overall housing geometry.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention transitions from traditional two-dimensional heat transfer (vapor chamber) to a three-dimensional configuration by adding multiple vertically stacked compartments. This dimensional expansion allows heat to be transferred both horizontally within compartments and vertically between compartments through the heat pipe, creating a multi-directional heat transfer pathway that better addresses non-uniform heat distribution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermal module effectively transfers heat both two-dimensionally and one-dimensionally, providing superior heat dissipation for heat sources with non-uniform heat distribution by increasing the working fluid capacity and allowing independent vapor-liquid circulations within compartments and heat pipe chambers without interference.

Implementation Method 1

the liquid working fluid in the evaporation section of the housing evaporates into vapor working fluid to transfer the heat to the condensation section of the housing

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 2

The vapor working fluid is cooled and condensed into liquid phase

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

Under gravity or capillary attraction of the capillary structures, the liquid working fluid flows back to the evaporation section for next vapor-liquid circulation

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 4

The vapor chamber serves to two-dimensionally face-to-face transfer heat, while the heat pipe serves to one-dimensionally transfer heat

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10107558B2Thermal module
Publication Date: 2018.10.23 ASIA VITAL COMPONENTS CO LTD
  • US10107558B2 patent drawing
  • US10107558B2 patent drawing
  • US10107558B2 patent drawing

AI summary

A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers.