Thermal Module With Segmented Compartments For Non-Uniform Heat Dissipation
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Solution Overview
Problem
Existing thermal solutions for electronic components face challenges in efficiently dissipating non-uniformly distributed heat, as vapor chambers and heat pipes are limited in their ability to handle heat distribution across the surface of high-power components with varying heat densities.
Innovation Solution
A thermal module with multiple independent compartments connected to heat pipes, allowing for independent vapor-liquid circulations and enhanced heat transfer capabilities, combining the heat spreading function of vapor chambers with the remote end heat transfer function of heat pipes, thereby increasing the capacity for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a vapor chamber is used for heat dissipation, then two-dimensional heat transfer is achieved, but the heat transfer efficiency for non-uniformly distributed heat sources is insufficient
Solution Approach 1:
The housing is divided into multiple independent compartments (first compartment, second compartment, third compartment, fourth compartment) that are spatially separated and independently filled with working fluid. Each compartment can independently perform vapor-liquid circulation, allowing parallel heat transfer operations that increase overall heat dissipation efficiency without requiring complex inter-compartment heat transfer mechanisms.
Solution Approach 2:
The invention transitions from traditional two-dimensional heat transfer (vapor chamber) to a three-dimensional configuration by adding multiple vertically stacked compartments. This dimensional expansion allows heat to be transferred both horizontally within compartments and vertically between compartments through the heat pipe, creating a multi-directional heat transfer pathway that better addresses non-uniform heat distribution.
2Temperature
If a heat pipe is used for heat dissipation, then one-dimensional heat transfer is achieved, but the heat spreading capability is limited
Solution Approach 1:
The invention merges the heat pipe structure with multiple vapor chamber compartments into a hybrid thermal module. The heat pipe serves as both a one-dimensional heat transfer conduit and a structural support for multiple compartments, combining the advantages of both heat pipe (efficient heat conduction) and vapor chamber (heat spreading) technologies in a unified structure.
Solution Approach 2:
The heat pipe chamber serves multiple functions: it acts as a heat conduction pathway, provides structural support for the compartments, and serves as a reservoir for working fluid. The independent compartments simultaneously function as heat absorption zones and vapor-liquid circulation chambers, creating a multi-functional thermal management system.
3Temperature
If multiple independent compartments are used to handle non-uniform heat distribution, then heat dissipation effectiveness is improved, but the device complexity increases
Solution Approach 1:
The housing is divided into multiple independent compartments (first compartment, second compartment, third compartment, fourth compartment) that are spatially separated and independently filled with working fluid. Each compartment can independently perform vapor-liquid circulation, allowing parallel heat transfer operations that increase overall heat dissipation efficiency without requiring complex inter-compartment heat transfer mechanisms.
Solution Approach 2:
Each compartment is independently filled with working fluid and can be optimized for specific heat transfer requirements. The partitioning board creates distinct thermal zones that can handle different heat densities locally, allowing the system to adapt to non-uniform heat distribution patterns without requiring complex overall system redesign.
4Temperature
If the capacity of working fluid is increased to maximize heat transfer, then heat transfer capability is improved, but the volume of the thermal module increases
Solution Approach 1:
The multiple compartments are nested within the housing structure, with each compartment occupying a defined spatial region. The partitioning board efficiently divides the internal volume while minimizing wasted space. This nested arrangement allows maximum working fluid capacity within a compact footprint, as each compartment is tightly integrated into the overall housing geometry.
Solution Approach 2:
The invention transitions from traditional two-dimensional heat transfer (vapor chamber) to a three-dimensional configuration by adding multiple vertically stacked compartments. This dimensional expansion allows heat to be transferred both horizontally within compartments and vertically between compartments through the heat pipe, creating a multi-directional heat transfer pathway that better addresses non-uniform heat distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal module effectively transfers heat both two-dimensionally and one-dimensionally, providing superior heat dissipation for heat sources with non-uniform heat distribution by increasing the working fluid capacity and allowing independent vapor-liquid circulations within compartments and heat pipe chambers without interference.
Implementation Method 1
the liquid working fluid in the evaporation section of the housing evaporates into vapor working fluid to transfer the heat to the condensation section of the housing
Implementation Method 2
The vapor working fluid is cooled and condensed into liquid phase
Implementation Method 3
Under gravity or capillary attraction of the capillary structures, the liquid working fluid flows back to the evaporation section for next vapor-liquid circulation
Implementation Method 4
The vapor chamber serves to two-dimensionally face-to-face transfer heat, while the heat pipe serves to one-dimensionally transfer heat
Data Source
AI summary
A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers.


