Thermal Management Mounting Assembly for Controlled Force Loading
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Solution Overview
Problem
Existing thermal management devices (TMDs) face challenges in accurately controlling and verifying mounting forces, leading to poor performance and potential thermal runaway conditions due to uneven force distribution and co-planarity issues, especially in silicon devices with irregular thermal hotspots.
Innovation Solution
A system and method using TMD force-control mounting assemblies (TFCMAs) with instrumented actuators and compression and locking interfaces to apply precise, repeatable, and verifiable mounting forces, ensuring accurate installation through programmable controllers and feedback mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional mounting methods are used for thermal management devices, then installation is simple, but mounting force control is inaccurate leading to poor performance and thermal runaway conditions
Solution Approach 1:
The mounting assembly uses a spring-loaded mechanism that dynamically adjusts and maintains a predetermined mounting force on the silicon device. The spring element provides continuous force compensation, allowing the system to adapt to variations in device geometry and thermal expansion while maintaining precise force control throughout operation.
Solution Approach 2:
The mounting assembly incorporates sensors and control mechanisms that monitor the actual mounting force applied to the silicon device. This feedback is used to verify that the predetermined force is achieved and maintained, preventing both under-mounting (which causes poor thermal contact) and over-mounting (which causes device damage).
2Reliability
If high mounting force is applied to ensure thermal contact, then thermal management effectiveness improves, but uneven force distribution causes co-planarity issues and potential device damage
Solution Approach 1:
The mounting assembly applies force through multiple distributed contact points rather than a single concentrated load. This distributes the mounting force evenly across the thermal management device and silicon device interface, ensuring uniform thermal contact while preventing localized stress concentrations that could cause co-planarity issues or device damage.
Solution Approach 2:
The spring-loaded mechanism provides a cushioning effect by elastic deformation, absorbing excess force and preventing sudden or uneven force application. This cushioning protects the silicon device from thermal runaway conditions while ensuring sufficient contact pressure for effective thermal management.
Data Source
AI summary
Systems and methods for controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. A system includes a mounting assembly for a thermal management device. The mounting assembly includes a fastener and a coupler. The system further includes a compression and locking interface configured to lock with the coupler and compress the mounting assembly to a predetermined loading point using a controlled force. The fastener is installed when the mounting assembly is at the predetermined loading point.