Thermal Mounting Structure for Vehicle Electronic Heat Dissipation
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Solution Overview
Problem
Conventional vehicle mounting structures fail to provide effective thermal conductivity pathways between electronic devices and the vehicle body due to poor thermal contact, leading to inefficient heat dissipation.
Innovation Solution
A mounting structure with a thermally conductive base wall featuring bumps and tabs that secure to a vehicle panel, forming a thermally conductive pathway through which heat generated by electronic devices can flow to the panel, utilizing materials like aluminum for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional mounting structure is used to support an electronic device, then the device can be mounted to the vehicle body, but poor thermal contact between the mounting structure and the vehicle body inhibits effective heat dissipation
Solution Approach 1:
The mounting structure incorporates a textured region with bumps on the outer surface that provides localized enhanced thermal contact areas with the vehicle panel, while the inner surface remains smooth for device mounting. This local quality enhancement at the thermal contact interface improves heat transfer without affecting the overall mounting function.
Solution Approach 2:
The outer surface of the mounting structure is transformed from a smooth surface to a textured surface with bumps, changing the surface geometry parameter to increase thermal contact area and improve thermal conductivity between the mounting structure and vehicle panel.
2Strength
If the base wall is made thick to improve structural strength, then mounting reliability increases, but thermal conduction pathway length increases reducing heat dissipation efficiency
Solution Approach 1:
The mounting structure uses a smooth inner surface for structural integrity and device mounting, while the outer surface features a textured region with bumps for enhanced thermal contact. This local differentiation allows the structure to maintain strength while optimizing thermal conduction at the critical interface with the vehicle panel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat from electronic devices to the vehicle panel via thermal conduction, improving cooling efficiency and ensuring better thermal management.
Implementation Method 1
base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall
Data Source
AI summary
A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side. The outer side includes a plurality of bumps configured to engage the panel. The base wall includes a plurality of tabs. Each tab configured to receive a corresponding fastener to secure the base wall to the panel.