Thermal Pad Assembly Modeling for Electronic Package Reliability
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Solution Overview
Problem
Hardware designers face uncertainty regarding the mechanical reliability of electronic packages with compressed thermal pads and gaskets, as CAD geometries are typically provided in an assembled position with components in their resting states, leading to unknown mechanical performance until physical testing.
Innovation Solution
A computer-implemented system and method that simulates the mechanical properties of electronic assemblies by identifying geometric interference, generating displacements, and determining non-linear contacts to model the stress state of compressible bodies like thermal pads and gaskets within the assembly, allowing for virtual testing of mechanical performance before physical assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If CAD geometries are provided in assembled position with components in resting states, then manufacturing and design process is simplified, but mechanical reliability cannot be determined until physical testing
Solution Approach 1:
The patent applies preliminary action by performing automated simulation analysis before physical assembly to determine the stress state and mechanical reliability of compressible bodies. The system calculates geometric interference, generates displacements, and determines non-linear contacts in advance, allowing designers to assess mechanical properties during the design phase rather than waiting for physical testing.
Solution Approach 2:
The patent uses copying by creating a digital simulation model that replicates the physical assembly's mechanical behavior. The automated simulation generates a virtual representation of the stress state, geometric interference, and contact forces, allowing designers to test mechanical reliability in the digital domain before physical manufacturing and testing.
2Measurement precision
If physical testing is performed to determine mechanical properties, then accurate mechanical reliability data is obtained, but development time and cost increase
Solution Approach 1:
The system performs preliminary simulation analysis to obtain mechanical property data before physical testing. By calculating geometric interference, generating displacements, and determining non-linear contacts in advance, the system provides accurate mechanical reliability information during the design phase, reducing the need for iterative physical testing and accelerating development time.
Solution Approach 2:
The patent replaces the physical mechanical testing system with an automated simulation system. Instead of physically assembling and testing components to determine mechanical properties, the system uses computational methods to calculate stress states, geometric interference, and contact forces, providing equivalent accuracy without the time and cost of physical testing.
3Reliability
If automated simulation is implemented, then mechanical reliability is determined early in design, but computational complexity increases
Solution Approach 1:
The automated simulation system applies self-service by automatically calculating geometric interference, generating appropriate displacements, and determining non-linear contacts without requiring manual intervention. The system self-configures the simulation parameters and processes based on the input CAD geometries, reducing the complexity burden on users while providing accurate mechanical reliability determination.
Solution Approach 2:
The system manages computational complexity by dynamically adjusting simulation parameters based on the specific geometry and assembly configuration. The automated process selects appropriate displacement values and contact parameters based on the calculated geometric interference, adapting the simulation complexity to the specific application rather than using fixed complex procedures for all cases.
Data Source
AI summary
Computer-implemented systems and methods are described herein for determining mechanical properties of an electronic assembly. An input specification for a model of the electronic assembly is received, wherein the input specification includes a compressible body and a surrounding component in the electronic assembly. A geometric interference between the compressible body and the surrounding component is identified. A displacement is generated for the compressible body to account for the geometric interference. A non-linear contact is then generated between the displaced compressible body and the surrounding component. The model is updated with the displacement and the non-linear contact. Then, a resulting force equilibrium is determined within the electronic assembly based on the updated model, wherein the resulting force equilibrium is determined by removing the displacement from the updated model.