Thermal Pad Removal From Carrier Film Using Peeling Edge

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Solution Overview

Problem

The automated handling of thermal pads with a pasty-solid consistency is challenging due to their lack of dimensional stability and flexibility, making it difficult to remove them from flexible carrier films efficiently.

Innovation Solution

A device comprising a tensioning device with a holding gripper, a peeling device with a peeling edge, and a pull-off drive to deflect and remove the carrier film from the thermal pad, along with optional clamping and removal grippers and suction systems for precise handling and positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal pads with pasty-solid consistency are used to improve thermal conduction, then heat transfer efficiency is improved, but automated handling and removal from carrier film becomes difficult due to lack of dimensional stability

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidautomated handling

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The thermal pad is pre-mounted on a rigid carrier film before processing. This preliminary action provides dimensional stability during automated handling, positioning, and removal operations. The carrier film serves as a temporary support structure that is removed after the thermal pad is properly positioned on the target component.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The rigid carrier film acts as an intermediary between the soft thermal pad and the automated processing system. It provides a stable platform for gripping, positioning, and removing the thermal pad without deforming it, enabling automated handling while maintaining the thermal pad's conformability to the target surface.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If thermal pads are made soft and plastically deformable to adapt to components, then thermal contact is improved, but automated removal from flexible carrier film is hampered

Engineering Contradiction:

Improvethermal contactVSAvoidremoval process complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal pad is pre-mounted on a rigid carrier film that provides structural support during automated processing. This preliminary support structure enables simple automated removal operations while the soft thermal pad maintains its ability to conform to the target component surface for optimal thermal contact.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system changes the rigidity parameter of the support structure by using a rigid carrier film instead of a flexible one. This parameter change enables automated handling and removal of soft thermal pads without requiring complex processing steps, while the thermal pad itself retains its softness for good thermal contact.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If rigid carrier film is used to provide stability during handling, then automated positioning is improved, but the flexibility needed for conforming to surfaces is reduced

Engineering Contradiction:

Improveautomated positioningVSAvoidsurface conformability

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The system segments the support function from the thermal conduction function. The rigid carrier film provides positioning stability during automated manufacturing, while the soft thermal pad provides surface conformability during application. This segmentation allows each component to optimize its specific function without compromise.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The rigid carrier film provides preliminary support for precise automated positioning and handling. After positioning, the carrier film is removed, allowing the thermal pad to conform to the target surface. This preliminary action enables both precise manufacturing and surface adaptability at different stages.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the automated and efficient removal of thermal pads from flexible carrier films, improving processing and application efficiency by maintaining thermal conductivity while ensuring precise alignment and handling.

Implementation Method 1

a removal gripper (14), in particular in the form of a suction plate connected to a suction fan (15) with a removal surface (17) and with suction openings (18) provided in the removal surface (17)

Methodology Applied

Scientific EffectNegative pressure (suction): Suction

Data Source

PatentEP4406890A1Device, arrangement and method for automatically detaching a thermally conductive pad from a carrier film

Publication Date: 2024.07.31 METALL UND KUNSTSTOFFWAREN ERZEUGUNGSGESELLSCHAFT MBH

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Figure 2a~2b
Figure 2c~2d

AI summary

Method, device and arrangement for the automated removal of a thermally conductive pad (1) from the front (3) of a flexible carrier film (2), comprising a clamping device (5) with an openable and closeable holding gripper (6) for gripping and holding the carrier film (2), a peeling device (7) with a peeling edge (8) for deflecting the carrier film around its back (4) and a peeling drive (9) which increases the distance (10) of the peeling edge (8) from the holding gripper (6) and is configured to move the carrier film (2) over the peeling edge (8) and thereby peel the carrier film (2) from the thermally conductive pad (1).