Thermal Pathway Packaging for Non-Groundable Component Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic components with non-groundable thermal outputs, such as cascode amplifiers, face challenges in heat dissipation due to the need to avoid short-circuiting to ground, which limits current flow and duty cycle, leading to potential overheating.
Innovation Solution
The implementation of a thermally conductive pathway within the substrate, using materials like aluminum nitride or silicon carbide, to isolate the non-groundable thermal output from the ground plane while allowing heat conduction through thermally conductive members such as copper pillars or solder balls, ensuring electrical isolation and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a non-groundable thermal output is used in an electronic component, then electrical isolation from ground is achieved, but heat dissipation is impaired leading to overheating
Solution Approach 1:
The patent introduces an intermediary structure - a thermally conductive member (such as a copper pillar or solder ball) that couples the non-groundable thermal output to a thermally conductive pathway embedded in the substrate. This intermediary enables heat transfer while maintaining electrical isolation, as the thermally conductive pathway is surrounded by electrically insulative material within the substrate.
Solution Approach 2:
The substrate's thermally conductive pathway is segmented and embedded within electrically insulative material. This segmentation allows the thermal conduction function to be separated from the electrical grounding function, enabling heat to be conducted away from the component while the electrical path to ground is blocked by the insulative material surrounding the pathway.
2Reliability
If current flow is limited to avoid short-circuiting, then electrical isolation is maintained, but heat dissipation efficiency decreases
Solution Approach 1:
The thermally conductive member acts as a dedicated intermediary for heat transfer, separating the thermal conduction path from the electrical current path. This allows heat to be efficiently conducted to the substrate while electrical current is blocked by the insulative material, enabling both functions to operate independently without compromising either electrical isolation or heat dissipation efficiency.
Solution Approach 2:
The substrate employs composite material construction with regions of different thermal and electrical conductivity. The thermally conductive pathway has high thermal conductivity but is surrounded by electrically insulative material, creating a composite structure that simultaneously enables efficient heat transfer while blocking electrical current flow to ground.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from non-groundable thermal outputs, preventing overheating while maintaining electrical isolation, thus ensuring stable operation of electronic components.
Implementation Method 1
at least one thermally conductive member coupling the output to the interface
Implementation Method 2
at least one thermally conductive pathway extending within the substrate between an interface exposed on the substrate and the ground plane
Data Source
AI summary
An electronic package is provided. The electronic package comprises an electronic component, a substrate, a ground plane, a thermally conductive pathway and at least one thermally conductive member. The ground plane is enclosed in or supported by the substrate. The electronic component includes a non-groundable thermal output and is mounted to the substrate. The thermally conductive pathway extends within the substrate between an interface exposed on a surface of the substrate and the ground plane. The thermally conductive pathway is configured to electrically isolate the interface from the ground plane. The thermally conductive member couples the output to the interface. An electronic device comprising such an electronic package is also provided.