Thermal Processing Plate Temperature Control for Line Width Uniformity
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Solution Overview
Problem
In photolithography processes, temperature variations across a thermal processing plate due to differences in thermal resistance lead to inconsistent line widths in resist patterns, requiring manual adjustment of temperature correction values by operators based on experience, resulting in variability in processing outcomes.
Innovation Solution
A method for stabilizing and optimizing the timing of temperature setting adjustments on a thermal processing plate by measuring substrate processing states, calculating the in-plane tendency using Zernike polynomials, and changing temperature correction values only when the improvable tendency exceeds a set threshold, ensuring consistent temperature control across regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If temperature correction values are adjusted manually by operators based on experience, then the temperature control can be adapted to processing conditions, but the timing and values vary between operators causing variations in line width
Solution Approach 1:
The system implements automated feedback control by measuring line width variations, calculating in-plane tendency using Zernike polynomials, and automatically adjusting temperature correction values based on measured deviations from target line widths, eliminating operator variability while maintaining adaptability
Solution Approach 2:
The system performs self-adjustment by automatically calculating optimal temperature correction values based on measured line width data and in-plane tendency analysis, enabling the system to correct its own temperature distribution without external intervention
2Manufacturing precision
If temperature correction values are changed frequently to optimize line width, then processing precision can be improved, but unnecessary changes increase system variability and complexity
Solution Approach 1:
The system applies partial action by changing temperature correction values only when the magnitude of in-plane tendency exceeds a predetermined threshold, avoiding unnecessary adjustments and maintaining setting stability while still achieving required precision when needed
Solution Approach 2:
The system dynamically changes temperature correction parameters based on measured line width variations and calculated in-plane tendency, adjusting only when parameter deviations exceed acceptable thresholds to maintain both precision and stability
Data Source
AI summary
A thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. From the calculated plurality of in-plane tendency components, in-plane tendency components improvable by changing the temperature correction values are extracted and added together to calculate an improvable in-plane tendency of the measured line widths within the substrate. The change of setting of the temperature correction value for each of the thermal plate regions of the thermal plate is performed only when the magnitude of the improvable in-plane tendency exceeds a threshold value set in advance.