Thermal Plate Temperature Control for Photolithography Line Width
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Solution Overview
Problem
Current temperature setting methods for thermal processing plates in photolithography processes are inefficient, leading to variations in line width due to subjective operator adjustments and a lengthy try-and-error process, resulting in inconsistent results across operators.
Innovation Solution
A method that measures processing states on a substrate, calculates in-plane tendencies, and adjusts temperature correction values using a calculation model to accurately estimate and improve temperature settings across multiple regions of a thermal processing plate, allowing for precise and time-efficient temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If temperature correction values are adjusted through repeated try-and-error measurements by operators, then line width can be improved, but the time required for temperature setting increases significantly
Solution Approach 1:
The patent pre-calculates and stores the relationship between temperature correction values and line width changes in a lookup table before actual temperature setting operations. This allows operators to quickly determine appropriate correction values without repeated measurements and adjustments, significantly reducing the time required while maintaining precision.
Solution Approach 2:
The patent creates a computational model that copies and simulates the complex thermal processing behavior, allowing prediction of line width outcomes without physical experimentation. This virtual model enables rapid determination of optimal temperature correction values without time-consuming repeated measurements.
2Productivity
If temperature correction values are set based on operator experience and subjective judgment, then temperature setting can be completed relatively quickly, but line width varies among operators
Solution Approach 1:
The patent enables the system to automatically determine optimal temperature correction values using pre-stored data and computational algorithms, eliminating reliance on operator experience and subjective judgment. The system serves itself by objectively calculating the best settings based on measured relationships between temperature and line width.
Solution Approach 2:
The patent implements an objective feedback mechanism where measured line width data is used to update and refine the relationship model between temperature correction values and processing outcomes. This creates a self-improving system that provides consistent, data-driven recommendations independent of operator subjectivity.
3Measurement precision
If multiple repeated measurements and adjustments are performed to achieve appropriate line width, then temperature precision can be improved, but the complexity of the temperature setting operation increases
Solution Approach 1:
The patent pre-establishes the relationship between temperature correction values and line width outcomes through offline measurements and calculations. This preliminary work creates a ready-to-use reference system that simplifies the actual temperature setting operation to a simple lookup and application process, eliminating the need for complex repeated measurements and adjustments.
Data Source
AI summary
In the present invention, a thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and, from an in-plane tendency of the measured line widths, an in-plane tendency improvable by temperature correction and an unimprovable in-plane tendency are calculated using a Zernike polynomial. An average remaining tendency of the improvable in-plane tendency after improvement obtained in advance is added to the unimprovable in-plane tendency to estimate an in-plane tendency of the line widths within the substrate after change of temperature setting.