Thermal Conducting Plate Control for Uniform Wide-Range Temperature

The patent introduces a thermal conducting plate as an intermediary between the temperature control system and the tested object. This plate has high thermal conductivity to ensure uniform heat distribution across its surface, while the tested object is placed on top of it. The thermal conducting plate acts as a mediator that decouples the direct contact requirement from the thermal uniformity requirement, allowing air to be used as the cooling medium while maintaining temperature uniformity through the plate's high conductivity.

The patent divides the temperature control system into two independent modules: a TEC module for precise temperature control within a limited range, and a heating unit for providing additional heating capability to extend the overall temperature range. The TEC module maintains precise control and uniformity, while the heating unit supplements the temperature control range by providing heating functionality that the TEC alone cannot achieve. This segmentation allows the system to achieve both precision and wide temperature range.

The patent replaces the mechanical airflow control system with a thermal conduction-based system. Instead of using airflow to achieve rapid temperature variation, the system uses a heating unit that can be rapidly activated or deactivated to heat the thermal conducting plate. The high thermal conductivity of the plate ensures rapid and uniform temperature distribution across the tested object, eliminating the need for complex airflow control mechanisms while maintaining fast response capability.