Thermal Protection Plate Positioning for Rapid Wafer Temperature Modulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor processing technologies face challenges in quickly modulating the substrate temperature due to difficulties in rapidly changing the temperature of large volumes of materials within the chamber, which radiate heat and hinder quick temperature changes.
Innovation Solution
The introduction of a thermal protection plate with low emissivity and high thermal conductivity, positioned between the susceptor and the substrate, allows for rapid heating and cooling by acting as a radiation shield and an excellent heat spreader, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a thermal protection plate with low emissivity and high thermal conductivity is introduced between the susceptor and substrate, then temperature modulation speed is improved, but device complexity increases
Solution Approach 1:
A thermal protection plate is introduced as an intermediary component between the susceptor and substrate. This plate has low emissivity to reduce radiative heat transfer and high thermal conductivity to enable rapid heat conduction when needed. The plate acts as a controllable thermal mediator that can be positioned close to or far from the susceptor to modulate substrate temperature rapidly without requiring changes to the entire chamber environment.
2Use of energy by moving object
If the thermal protection plate is positioned close to the susceptor for rapid heating, then heating efficiency is improved, but cooling capability deteriorates due to increased radiative heat transfer
Solution Approach 1:
The system dynamically adjusts the position of the thermal protection plate relative to the susceptor. During heating phases, the plate is positioned close to the susceptor to maximize thermal coupling and heating efficiency. During cooling phases, the plate is moved away from the susceptor to reduce radiative heat transfer and enhance cooling capability. This dynamic repositioning allows the same component to optimize both heating and cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables more precise and rapid temperature control of the substrate, improving processing efficiency and overcoming the limitations of existing technologies.
Implementation Method 1
acts as a radiation shield
Implementation Method 2
high thermal conductivity... acts as an excellent heat spreader
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
A method, system and apparatus for substrate processing that includes a susceptor, a thermal protection plate disposed above the susceptor, the thermal protection plate includes a first lift pin through-hole extending from a top surface of the thermal protection plate to a bottom surface of the thermal protection plate, the susceptor includes a second lift pin through-hole and a plate lift member through-hole, and a plate lift member configured to slidably engage the plate lift member through-hole.