Thermal Conductive Polymer via Multi-Stage Elongation
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Solution Overview
Problem
Thermoplastic resin compositions face limitations in thermal conductivity compared to inorganic materials, leading to challenges in heat emission and transfer, and the addition of high thermal conductive fillers compromises injection moldability and product quality.
Innovation Solution
A method involving the fabrication of a thermal conductive polymer through a multi-stage elongation process of ultra high molecular weight polyolefin resin and solvents, enhancing crystallization and orientation without the need for thermal conductive fillers, including primary, secondary, tertiary, and quaternary elongation steps, and solvent removal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of highly thermal conductive inorganic filler is added to thermoplastic resin composition, then thermal conductivity is improved, but injection moldability deteriorates
Solution Approach 1:
The invention changes the fundamental parameter from using inorganic filler to using ultra high molecular weight polyolefin resin with molecular weight of 3,000,000 to 10,000,000. This parameter change enables achieving high thermal conductivity (0.3 to 0.5 W/m·K) without the negative effects of filler addition, as the polymer matrix itself provides the thermal conduction pathway through its molecular structure and orientation.
Solution Approach 2:
The invention extracts and eliminates the inorganic filler component from the thermal conductive composition. By removing the filler and relying solely on the polyolefin resin matrix with optimized molecular weight and crystallinity, the invention achieves thermal conductivity improvement without compromising injection moldability or causing mold contamination.
2Temperature
If a large amount of highly thermal conductive inorganic filler is added to thermoplastic resin composition, then thermal conductivity is improved, but molding workability deteriorates
Solution Approach 1:
The invention changes the material parameter from filler-based composite to high molecular weight polymer-based material. The polyolefin resin with molecular weight of 3,000,000 to 10,000,000 provides inherent thermal conductivity while maintaining excellent molding workability, as it processes as a homogeneous polymer melt without filler-related issues.
3Temperature
If a large amount of highly thermal conductive inorganic filler is added to thermoplastic resin composition, then thermal conductivity is improved, but physical properties deteriorate
Solution Approach 1:
The invention removes the inorganic filler that causes physical property deterioration. By using pure polyolefin resin with optimized molecular weight and controlling crystallization, the invention achieves thermal conductivity enhancement while preserving tensile strength, elongation, and other critical physical properties that would otherwise be compromised by filler addition.
4Temperature
If inorganic filler is added to thermoplastic resin composition, then thermal conductivity is improved, but mold contamination occurs
Solution Approach 1:
The invention extracts and eliminates the inorganic filler source of mold contamination. By using a filler-free polyolefin resin system, the invention prevents bleed-out and contamination issues that occur with inorganic fillers, while still achieving the desired thermal conductivity through the polymer matrix itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves thermal conductivity while maintaining excellent production efficiency and economical feasibility, achieving a high degree of crystallization and orientation without deteriorating physical properties or moldability.
Implementation Method 1
a fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling
Implementation Method 2
a fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation
Data Source
AI summary
Provided is a method of fabricating a thermal conductive polymer, including: a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed.