Thermal Post Cartridge Socket for Microelectronic Device Testing
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Solution Overview
Problem
Existing microelectronic circuit testing methods are inefficient and inadequate for early-stage defect identification, particularly during wafer singulation and post-mounting stages, lacking comprehensive testing apparatus and methods for reliable performance evaluation.
Innovation Solution
A testing apparatus and method involving a frame with slot assemblies, horizontal and vertical transportation mechanisms, and a cartridge system with insulative sockets and thermally conductive posts for precise power and thermal management, enabling comprehensive testing of microelectronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafer level testing is performed using a handler and contactor, then early stage defects can be identified, but the testing process becomes complex and time-consuming
Solution Approach 1:
The testing apparatus is segmented into modular components: a cartridge holding structure for the wafer, a slot assembly with contactor, and a transportation system. This segmentation allows each component to perform its function independently, simplifying the overall system while maintaining comprehensive testing capability across multiple wafer positions
Solution Approach 2:
The slot assembly is designed as a universal testing station that can test multiple wafers sequentially. The contactor and handler system are configured to accommodate different wafer positions and orientations, enabling a single apparatus to perform comprehensive testing across entire wafers rather than individual devices, thereby reducing overall system complexity
2Reliability
If individual dies are tested after singulation, then post-manufacturing defects can be identified, but testing time and productivity are reduced
Solution Approach 1:
The apparatus performs preliminary testing at the wafer level before singulation, identifying and isolating defective regions in advance. This preliminary action allows subsequent individual die testing to focus only on potentially good devices, significantly reducing the number of devices requiring detailed individual testing and thereby increasing overall productivity
Solution Approach 2:
The transportation apparatus enables continuous testing operations by seamlessly moving wafers through the slot assembly. Multiple wafers can be tested in sequence without interrupting the testing process, maintaining continuous useful action and maximizing productivity while ensuring comprehensive defect identification across all wafers
3Reliability
If thermal control is applied to the wafer during testing, then temperature-related performance can be evaluated, but the testing system complexity increases
Solution Approach 1:
The thermal control system is merged with the existing cartridge and slot assembly structures. Heating or cooling elements are integrated into the cartridge that already holds the wafer, and the slot assembly incorporates thermal management components. This merging allows temperature control to be achieved using the existing mechanical framework, minimizing additional system complexity while enabling accurate temperature-related performance evaluation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient and thorough testing of microelectronic devices at various stages, ensuring early defect identification and performance evaluation with improved thermal control and electrical connectivity.
Implementation Method 1
a first thermal post attached to the chuck, the first thermal post being inserted into the first socket thermal opening, an end of the first thermal post being thermally connected to the first device, such that heat transfers primarily through the first thermal post
Data Source
Figure 1
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AI summary
The invention provides a cartridge comprising a socket made of insulative material and having upper and lower sides, the upper side having a first formation for releasably holding a first electronic device, the socket having a first socket thermal opening formed from the lower side to the upper side through the socket, an interface connected to the socket to connect the first electronic device to an electric tester, a chuck of a thermally conductive material, a first thermal post attached to the chuck, the first thermal post being inserted into the first socket thermal opening, an end of the first thermal post being thermally connected to and in contact with the first electronic device, such that heat transfers primarily through the first thermal post as opposed to the insulative material of the socket between the chuck and the first electronic device, and a first set of contacts held in the socket and connecting terminals of the first electronic device to the interface, the first set of contacts being resiliently depressible to bring the first electronic device into contact with the end forming a first thermal surface of the first thermal post.