Thermal Print Head Wear-Resistance via CVD Coating
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Solution Overview
Problem
The manufacturing efficiency of thermal print heads is low due to the complex process of forming protection films, which also affects the wear-resistance against recording media.
Innovation Solution
A thermal print head design featuring a substrate with a resistance layer, wiring layer, protection layer, and a coating layer that includes metal elements, where the coating layer overlaps the heating portions and has a higher Vickers hardness than the protection layer, formed using a combination of sputtering and electroplating processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protection film is formed by sputtering to enhance wear-resistance, then the wear-resistance against recording medium is improved, but the manufacturing efficiency deteriorates due to complex air pressure adjustment and multiple deposition steps
Solution Approach 1:
The invention changes the deposition method from sputtering to CVD (Chemical Vapor Deposition), fundamentally altering the process parameters. CVD allows silicon films to be deposited without the complex air pressure adjustments required by sputtering, while achieving the same protective function with simpler process control and higher efficiency
Solution Approach 2:
The invention replaces the physical sputtering process with a chemical deposition process. Instead of using physical bombardment and air pressure control, CVD uses chemical reactions in the vapor phase to deposit silicon films, eliminating the mechanical complexity of sputtering equipment and process control
2Reliability
If the hardness of the protection film is increased to improve wear-resistance, then the wear-resistance is enhanced, but the thermal stress concentration increases causing cracking
Solution Approach 1:
The invention changes the deposition method to CVD, which produces silicon films with different stress characteristics compared to sputtering. CVD-deposited films have more favorable stress distributions that reduce thermal stress concentration while maintaining high hardness and wear-resistance
Solution Approach 2:
The invention uses a multi-layer structure consisting of a silicon-based protection film and an organic coating layer. This composite structure combines the high hardness and thermal resistance of silicon with the flexibility and stress-absorbing properties of the organic layer, preventing cracking while maintaining wear-resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances wear-resistance against recording media while improving manufacturing efficiency by reducing the complexity of the coating process and increasing the durability of the thermal print head.
Implementation Method 1
The heating resistor generates heat when a current flows in the multiple electrodes
Implementation Method 2
the protection film is formed by means of sputtering
Data Source
AI summary
The present disclosure provides a thermal print head and a method manufacturing thereof and a thermal printer including the thermal print head, which are capable of suppressing low manufacturing efficiency and enhancing wear-resistance against a recording medium. The thermal print head includes: a substrate, having a main surface facing a thickness direction; a resistance layer, including multiple heating portions arranged in a main scan direction and formed on the main surface; a wiring layer, formed on the resistance layer and connected to the heating portions; and a protection layer, covering a part of the main surface, the heating portions and the wiring layer.