Thermal processing apparatus and thermal processing method
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Solution Overview
Problem
The existing substrate cooling apparatus requires complex control to restore the heat conduction plate to its initial temperature after cooling, reducing processing efficiency.
Innovation Solution
A thermal processing apparatus with a temperature adjuster, detector, and control switch that applies a first control value when the detected temperature is below a threshold and a higher second control value when it exceeds the threshold, switching between these controls to maintain set temperature efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the heat conduction plate is cooled at maximum capacity by Peltier elements to quickly cool the substrate, then the substrate cooling speed is improved, but the control complexity increases and processing efficiency is reduced
Solution Approach 1:
The patent applies dynamic control by switching between two operational modes: a first control mode that applies a first control value to quickly cool the heat conduction plate when the substrate temperature is high, and a second control mode that applies a second control value (lower than the first) when the substrate temperature approaches the target temperature. This dynamic switching resolves the contradiction by adapting the cooling intensity to the real-time temperature state, achieving fast cooling while preventing excessive complexity through standardized control value switching.
Solution Approach 2:
The patent changes the control parameter (control value applied to Peltier elements) based on the substrate temperature state. When the substrate temperature exceeds a first threshold, a first control value is applied for rapid cooling. When the temperature approaches the target range, a second control value (lower than the first) is applied to maintain stability. This parameter change strategy enables fast cooling while simplifying control logic through clear threshold-based parameter switching.
2Manufacturing precision
If the heat conduction plate is cooled at maximum capacity to achieve fast substrate cooling, then the substrate cooling performance is improved, but the processing efficiency is reduced due to complex temperature restoration control
Solution Approach 1:
The system dynamically adjusts the control value applied to Peltier elements based on substrate temperature feedback. The control switches between a first control value (for rapid cooling when temperature is high) and a second control value (for stable maintenance when temperature approaches target). This dynamic adaptation achieves high cooling performance while improving processing efficiency by avoiding complex continuous adjustment algorithms.
Solution Approach 2:
The patent implements feedback control by continuously monitoring substrate temperature and adjusting the control value applied to Peltier elements accordingly. When temperature exceeds a first threshold, the first control value is applied; when temperature approaches the target, the second control value is applied. This feedback mechanism ensures high cooling performance while simplifying the control process, thereby improving overall processing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies control and improves readiness and stability, allowing for accurate and efficient thermal processing by moderating temperature changes and preventing overshoot and undershoot.
Implementation Method 1
The cooling plate includes a heat conduction plate and Peltier elements. When the high-temperature substrate is carried to the heat conduction plate, the heat conduction plate and the substrate are cooled at maximum capacity by the Peltier elements.
Implementation Method 2
The cooling plate includes a heat conduction plate and Peltier elements. A high-temperature substrate before cooling processing is carried to the heat conduction plate.
Data Source
AI summary
An upper plate on which a substrate is placed is cooled or heated by a thermal processor. The temperature of the thermal processor is adjusted by a temperature adjuster. The temperature of the upper plate is detected. A control value that is to be applied to the temperature adjuster in order to maintain the temperature of the upper plate at a set value is calculated as a control arithmetic value on the basis of the detected temperature. When the control arithmetic value decreases to a value less than a second threshold value, a first control that applies the control arithmetic value to the temperature adjuster is performed. When the control arithmetic value increases to a value not less than a first threshold value, a second control that applies a control set value higher than the control arithmetic value to the temperature adjuster is performed.