Thermal Redistribution Pattern for Multi-Chip Package Heat Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multi-chip packages (MCPs) face poor thermal characteristics due to varying heat generation among different semiconductor chips, leading to localized overheating and potential degradation of semiconductor chips, as high power chips generate more heat than low power chips, which is not efficiently dissipated due to the use of materials with low thermal conductivity like epoxy molding compounds.
Innovation Solution
Incorporating a thermal redistribution pattern with high thermal conductivity materials like copper, disposed between high and low temperature regions, to facilitate efficient heat transfer from high temperature areas adjacent to high power chips to low temperature areas, thereby preventing overheating and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If various types of semiconductor chips are integrated into a single MCP package, then functionality and performance are improved, but thermal characteristics deteriorate due to localized heat accumulation
Solution Approach 1:
A thermal redistribution pattern serving as a thermal intermediary is introduced between high-power and low-power semiconductor chips. This pattern facilitates heat transfer from high-temperature regions to low-temperature regions, acting as a mediator that balances thermal distribution across the package without requiring fundamental changes to the chip integration architecture.
Solution Approach 2:
The thermal redistribution pattern is strategically positioned in specific regions where temperature differences exist. By placing thermal conduction paths locally between high-power and low-power chips, the solution addresses thermal imbalances at the source rather than requiring uniform thermal management across the entire package.
2Power
If high power semiconductor chips are used to generate more performance, then processing capability is improved, but heat generation increases causing localized overheating
Solution Approach 1:
The thermal redistribution pattern converts the harmful effect of localized heat accumulation into a beneficial thermal balancing mechanism. By providing dedicated thermal conduction paths, the heat generated by high-power chips is redirected to low-power chips that can dissipate it, transforming a problematic byproduct into a manageable thermal flow.
3Ease of manufacture
If epoxy molding compound is used for packaging, then manufacturing ease is improved, but thermal conductivity is poor leading to inefficient heat dissipation
Solution Approach 1:
The package structure becomes a composite system combining epoxy molding compound with high thermal conductivity thermal redistribution patterns. This composite approach maintains the manufacturing advantages of epoxy while adding thermal management capabilities through the integrated thermal conduction paths, achieving both ease of manufacture and improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal redistribution pattern effectively disperses heat from high temperature regions to low temperature regions, reducing the risk of overheating and enhancing the thermal performance and reliability of semiconductor packages by ensuring consistent temperature distribution across the package.
Implementation Method 1
a thermal redistribution pattern which are disposed on a package substrate... configured to reduce a bottleneck phenomenon of heat transmission when transferring heat from the first end portion to the second end portion
Data Source
AI summary
A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.