Localized Bonding Link with Thermal Release for Low-Shock Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing connection devices for payloads and payload distributors in aeronautical and space vehicles suffer from excessive shock induction and high reaction time dispersion during separation, making them unsuitable for efficient and controlled payload release.
Innovation Solution
A connecting device featuring a multidirectional adhesive layer and thermogenic material, allowing for rapid heating and separation with minimized shock and reaction time dispersion, comprising a first and second base with connecting walls and an internal thermogenic material for efficient force transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If segmented retaining nuts with fuse elements or movable elements are used for connection, then the connection can be disconnected on command, but the release induces too powerful shocks and has too great dispersion of reaction times
Solution Approach 1:
The patent replaces the mechanical disconnection system (segmented retaining nuts with fuse elements or movable elements) with a thermal system. A thermogenic material generates heat to melt a fusible material that bonds the adhesive layer to the first base, substituting mechanical force with thermal energy for controlled separation.
Solution Approach 2:
The patent utilizes phase transition of the fusible material from solid to liquid through melting. The fusible material is bonded to the adhesive layer and the first base, and when the thermogenic material generates heat, the fusible material melts, enabling controlled separation without mechanical shock.
2Ease of operation
If segmented retaining nuts with fuse elements or movable elements are used for connection, then the connection can be disconnected on command, but the reaction times have too great dispersion
Solution Approach 1:
The patent replaces the mechanical disconnection system with a thermal system. A thermogenic material generates heat to melt a fusible material that bonds the adhesive layer to the first base, substituting mechanical force with thermal energy for controlled separation.
Solution Approach 2:
The patent changes the physical state of the fusible material from solid to liquid through temperature increase. The fusible material has a specific melting point, and when the thermogenic material generates sufficient heat, the phase transition occurs rapidly and consistently, reducing reaction time dispersion.
3Adaptability or versatility
If adhesive layers are used for connection, then localized connection is achieved, but the connection forces are insufficient for payload attachment
Solution Approach 1:
The patent creates a composite connection system consisting of three layers: an adhesive layer for bonding, a fusible material layer for controlled release, and a thermogenic material for triggering separation. This composite structure combines the strength of adhesive bonding with the controlled separability of thermal melting.
Solution Approach 2:
The patent implements a nested structure where the fusible material is positioned between the adhesive layer and the first base, and the thermogenic material is positioned adjacent to the fusible material. This nested arrangement allows the different materials to work together in a compact configuration, with each layer serving its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves efficient force transmission and rapid separation with reduced shock and reaction time dispersion, making it suitable for localized connections between payloads and distributors, such as satellites and microsatellites, with reaction times of around 100 milliseconds and less than 10% dispersion.
Implementation Method 1
a thermogenic material arranged in said internal volume so as to allow heating of the bonding layer by thermal conduction through the first connecting wall
Implementation Method 2
heating of the bonding layer by thermal conduction through the first connecting wall
Data Source
Figure 1~2
Figure 3~4
Figure 5~5A
AI summary
To enable localized bonding with separation on command, a bonding device (20) comprises a first base (24), a first bonding wall (22) forming an outgrowth from the first base (24), and having, on a first side, an internal surface (22A) delimiting an internal volume (V) on the side of the first base, and, on a second side, a first bonding surface (22B), a second base (28), a second bonding wall (26) integral with the second base and having a second bonding surface (26A) covering the first bonding wall (22) so as to provide a space (S) between the first and second bonding surfaces, a bonding layer (30) arranged in said space and extending in cross-section in at least two distinct directions, and a thermogenic material (32) arranged in the internal volume so as to allow heating of the bonding layer.