Thermal Release Adhesive Substrate Thinning for Low-Defect Separation
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Solution Overview
Problem
The challenge in manufacturing electronic devices is to simplify the manufacturing process while improving quality, yield, performance, and reliability, particularly in the context of making devices lighter, thinner, and more compact.
Innovation Solution
A manufacturing method involving a thermal release adhesive layer on a substrate, followed by thinning and cutting processes, which includes etching, polishing, laser cutting, and beveling to form sub-substrates, with the adhesive layer being separated to facilitate substrate separation and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If thinning process and cutting process are performed on the substrate, then the electronic device becomes lighter and thinner, but the manufacturing process becomes more complex and defects increase
Solution Approach 1:
The patent applies segmentation by dividing the substrate into multiple sub-substrates through a cutting process performed after thinning. This allows the thinning operation to be performed on a larger substrate first, achieving uniform thickness without the complexity of handling individual small substrates during thinning, thereby reducing manufacturing complexity while still achieving the final segmented product
Solution Approach 2:
The patent uses preliminary action by providing a protective adhesive layer on the substrate before performing the thinning process. This protective layer prevents defects during thinning and cutting operations, and the layer is removed only after the substrate has been thinned and cut into final sub-substrates, simplifying the overall process by combining protection and separation functions
2Length of stationary object
If thinning process and cutting process are performed on the substrate, then the electronic device becomes thinner and more compact, but manufacturing quality and yield deteriorate due to increased defects
Solution Approach 1:
The patent applies preliminary action by depositing the protective adhesive layer on the substrate surface before performing thinning and cutting operations. This protective layer prevents mechanical damage, reduces defects during processing, and maintains substrate integrity throughout the manufacturing process, thereby improving manufacturing quality and yield
Solution Approach 2:
The protective adhesive layer serves as an intermediary between the substrate and the thinning/cutting processes. It provides mechanical protection during processing, and its thermal release properties enable clean separation after processing is complete, thus improving manufacturing quality without compromising the final product
3Ease of manufacture
If protective adhesive layer is provided on substrate before thinning and cutting, then manufacturing process is simplified and defects are reduced, but additional materials and process steps are required
Solution Approach 1:
The protective adhesive layer performs multiple functions: it protects the substrate during thinning and cutting operations, serves as a release layer for easy separation of sub-substrates, and can be removed through thermal release. By combining protection, release, and separation functions into a single layer, the patent simplifies the overall manufacturing process despite adding one process step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces defects, and enhances the reliability and strength of electronic devices by using a thermal release adhesive to protect circuit layers and enable efficient substrate separation.
Implementation Method 1
A thermal release adhesive layer is provided on the first substrate
Implementation Method 2
The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate
Data Source
AI summary
A manufacturing method of an electronic device including following steps is provided. A first substrate is provided. A thermal release adhesive layer is provided on the first substrate. A thinning process is performed on the first substrate to form a first thinned substrate. A cutting process is performed on the first thinned substrate to form a first sub-substrate. The thermal release adhesive layer is separated from the first thinned substrate or the first sub-substrate. In the manufacturing method of the electronic device provided in one or more embodiments of the disclosure, the manufacturing process of the electronic device may be simplified, and/or defects of the resultant electronic device may be reduced.