Thermally Conductive Resin Composition With Stable PCB Insulation
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Solution Overview
Problem
Existing resin compositions for printed wiring boards do not effectively address the need for high thermal conductivity and insulation reliability, particularly in high-density semiconductor applications where heat dissipation is critical.
Innovation Solution
A resin composition containing an epoxy resin, an inorganic filler with specific thermal conductivity and particle size distribution, and either a heavy metal deactivator or an ion scavenger, with a defined content range, to enhance thermal conductivity while maintaining insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermal conductivity of the resin composition is improved by adding inorganic filler, then heat dissipation performance is enhanced, but insulation reliability may deteriorate due to increased ion migration risk
Solution Approach 1:
The patent changes the particle size parameter of the inorganic filler, specifically controlling the cumulative 99% particle size to be 50 μm or less. This parameter optimization enables both high thermal conductivity and good insulation reliability by reducing ion migration while maintaining heat dissipation performance
Solution Approach 2:
The patent creates a composite resin composition combining epoxy resin with specific inorganic fillers (such as aluminum oxide, aluminum nitride, or silicon oxide) having controlled particle size distribution. This composite structure achieves synergistic effects where the filler provides thermal conductivity while the optimized particle size prevents ion migration pathways
2Temperature
If the content of inorganic filler is increased to improve thermal conductivity, then heat dissipation is enhanced, but the composition becomes difficult to handle and process
Solution Approach 1:
The patent optimizes the particle size distribution parameter, specifically controlling the cumulative 99% particle size to be 50 μm or less. This parameter change improves flowability and fillability of the resin composition while maintaining high inorganic filler content (80-97 mass%), making the material easier to process
Solution Approach 2:
The patent applies different particle size ranges to different portions of the filler population. By controlling the cumulative 99% particle size (the larger end of the distribution) to be ≤50 μm while allowing smaller particles to exist, the composition achieves both good processability from fine particles and high thermal conductivity from the overall filler content
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves both high thermal conductivity and excellent insulation reliability, addressing the challenges of heat dissipation and device integration in high-density semiconductor applications.
Implementation Method 1
an inorganic filler (B) having a thermal conductivity equal to or greater than 10 W/m·K
Data Source
AI summary
A resin composition contains: an epoxy resin (A); an inorganic filler (B) having a thermal conductivity equal to or greater than 10 W/m·K; and at least one selected from the group consisting of a heavy metal deactivator (C) and an ion scavenger (D). The inorganic filler (B) has a volume-based cumulative 99% particle size equal to or less than 50 μm as measured by a laser diffraction particle size distribution analysis method. The content of the inorganic filler (B) is equal to or greater than 84% by mass and equal to or less than 97% by mass with respect to the resin composition.