Thermally Conductive Resin Composition for Uniform PCB Insulating Layers
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Solution Overview
Problem
Existing resin compositions for thermally conductive materials face a challenge in achieving high thermal conductivity while maintaining uniform thickness due to the trade-off between filler concentration and viscosity, leading to non-uniform multilayer printed wiring boards.
Innovation Solution
A resin composition comprising an epoxy resin, phenolic resin, and an inorganic filler, with a polyether ester flow adjuster containing no phosphorus atoms, and a specific particle size distribution of magnesium oxide, aluminum nitride, or aluminum oxide fillers, to maintain high thermal conductivity and uniform thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the concentration of inorganic filler is increased to increase thermal conductivity, then thermal conductivity is improved, but viscosity increases and flowability decreases
Solution Approach 1:
The patent changes the particle size distribution parameters of the inorganic filler, specifying at least two peaks within the range of 0.05-25 μm. This parameter optimization allows achieving high thermal conductivity (84-97% filler content) while maintaining acceptable flowability by controlling the physical characteristics of the filler particles.
Solution Approach 2:
The patent uses a composite resin system combining epoxy resin with phenolic resin and polyether ester flow adjuster. This composite approach creates a balanced formulation where the phenolic resin and flow adjuster compensate for the increased viscosity caused by high filler loading, enabling both high thermal conductivity and processability.
2Ease of operation
If the viscosity of resin composition is lowered to improve flowability, then flowability is improved, but thickness control becomes difficult
Solution Approach 1:
The patent optimizes the resin composition parameters by introducing phenolic resin and polyether ester flow adjuster in specific proportions. This creates a viscosity window that enables both adequate flowability for processing and sufficient thickness control for manufacturing precision, resolving the contradiction between ease of operation and manufacturing precision.
3Temperature
If high concentration of inorganic filler is used to achieve high thermal conductivity, then thermal conductivity is improved, but multilayer board thickness uniformity deteriorates
Solution Approach 1:
The patent specifies precise parameter ranges for the resin composition including phenolic resin content and polyether ester flow adjuster concentration. These parameter optimizations ensure that even at 84-97% filler loading, the resin composition maintains uniform flow characteristics that produce thickness uniformity of 10 μm or less across multilayer boards.
Solution Approach 2:
The patent employs a composite resin system where phenolic resin and polyether ester flow adjuster work synergistically with epoxy resin to maintain uniform flow and thickness control even at high filler concentrations, preventing the thickness non-uniformity that would otherwise occur in multilayer board manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves an insulating layer with enhanced thermal conductivity and uniform thickness, ensuring reliable electrical insulation and handling properties.
Implementation Method 1
an inorganic filler (D), wherein the content of the inorganic filler (D) is equal to or greater than 84% by mass and equal to or less than 97% by mass with respect to the entire mass of the resin composition
Implementation Method 2
a flow adjuster (C), wherein the flow adjuster (C) includes a polyether ester flow adjuster (C1) including no phosphorus atoms
Implementation Method 3
contains an epoxy resin (A), a phenolic resin (B), a flow adjuster (C), and an inorganic filler (D)
Data Source
AI summary
A resin composition contains an epoxy resin (A), a phenolic resin (B), a flow adjuster (C), and an inorganic filler (D). The flow adjuster (C) includes a polyether ester flow adjuster (C1) including no phosphorus atoms. The inorganic filler (D) includes at least one filler selected from the group consisting of a magnesium oxide filler, an aluminum nitride filler, and an aluminum oxide filler. The content of the inorganic filler (D) is equal to or greater than 84% by mass and equal to or less than 97% by mass with respect to the entire mass of the resin composition. The inorganic filler (D) has, in a volume-based particle size distribution measured by a laser diffraction and scattering method, at least two peaks within a range in which a particle size is equal to or greater than 0.05 μm and equal to or less than 25 μm.