Semiconductor Thermal Resistance Extraction Using Dual Sensor Arrays
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Solution Overview
Problem
Existing thermal modeling methods for semiconductor devices lack accurate methods for extracting thermal resistance, leading to inefficiencies in thermal design optimization and potential hot spots.
Innovation Solution
A structure and method for extracting thermal resistance in semiconductor devices using first and second sensor arrays with heaters and temperature sensors, measuring thermal resistance through measurable differences in thermal paths and dielectric regions, and computing thermal resistance based on temperature measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If thermal resistance is extracted using existing thermal modeling methods, then thermal design optimization can be performed, but the measurement precision of thermal resistance is insufficient leading to inaccurate hot spot prediction
Solution Approach 1:
The patent segments the thermal measurement system into multiple sensor arrays (first and second sensor arrays) with distinct thermal paths. Each sensor array measures thermal resistance through different dielectric regions, allowing separate extraction of thermal resistance values for different interconnect levels and regions, thereby improving measurement precision and reliability of hot spot prediction
Solution Approach 2:
The patent introduces temperature sensors as intermediary measurement devices between the heat source (interconnect) and the ambient environment. These sensors act as mediators to indirectly measure thermal resistance by detecting temperature differences, enabling accurate thermal characterization without directly measuring heat flow
2Measurement precision
If multiple sensor arrays with different thermal paths are used to extract thermal resistance, then measurement accuracy improves, but device complexity increases
Solution Approach 1:
The patent designs sensor arrays that serve multiple functions: they measure temperatures at multiple locations, extract thermal resistance for different interconnect levels, and characterize thermal properties of different dielectric regions. This multi-functionality reduces the need for separate measurement systems, thereby managing device complexity while maintaining high measurement precision
Solution Approach 2:
The patent extends thermal measurement from a single thermal path to multiple thermal paths by introducing sensor arrays with different thermal conductive paths. This dimensional extension allows simultaneous measurement of thermal resistance through different dielectric regions, improving accuracy without proportionally increasing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides accurate measurements of thermal resistance for improved thermal design optimization, enabling better evaluation of hot spots and thermal dissipation, and facilitating thermal calibration simulations.
Implementation Method 1
The first thermal path to ambient has a measurably different thermal resistance than the second thermal path to ambient
Implementation Method 2
a first temperature sensor configured to measure temperature of the heater; and second and third temperature sensors on opposite sides of the heater
Data Source
AI summary
A structure for extracting thermal resistance in semiconductor device includes first and second sensor arrays. Each sensor array of the first and second sensor arrays includes a heater; a first temperature sensor configured to measure temperature of the heater; and second and third temperature sensors on opposite sides of the heater. The heater and the temperature sensors of the first sensor array are along a first thermal path to ambient. The heater and the temperature sensors of the second sensor array are along a second thermal path to ambient. The first thermal path to ambient has a measurably different thermal resistance than the second thermal path to ambient.