Thermal Response Module for Electronic Device Temperature Stability

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Solution Overview

Problem

Electronic devices face challenges in maintaining optimal performance due to extreme temperature fluctuations, which can lead to overheating, sudden shutdowns, and data loss in memory devices such as DRAM and NAND.

Innovation Solution

The implementation of a thermal-responsive system that uses phase change materials (PCMs) or photochromic materials in conjunction with a temperature adjust module. This module detects the device's temperature and adjusts it through endothermic or exothermic reactions, or by utilizing solar energy, to maintain the device within a specific optimal temperature range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional memory devices are used without temperature adjustment, then device complexity is reduced, but reliability deteriorates due to overheating and sudden shutdowns at extreme temperatures

Engineering Contradiction:
Improvedevice reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A temperature adjust module is introduced as an intermediary component between the electronic device and the extreme temperature environment. This module actively regulates temperature by adding or removing thermal energy, thereby protecting the memory device from temperature-induced failures without requiring fundamental changes to the memory device itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system changes the thermal parameter (temperature) of the electronic device dynamically in response to environmental conditions. By actively adjusting temperature as a controllable parameter, the system maintains reliable operation across extreme temperature ranges that would otherwise cause shutdowns or data loss.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If the operating temperature range is expanded to cover extreme conditions, then adaptability is improved, but manufacturing precision deteriorates due to challenges in designing for large temperature ranges

Engineering Contradiction:
Improvetemperature range adaptabilityVSAvoiddesign precision
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The temperature management function is segmented into a separate, dedicated temperature adjust module rather than being integrated into the memory device design itself. This allows the memory device to be manufactured with standard precision while the temperature adaptation function is handled by a specialized auxiliary component.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The temperature adjust module serves as an intermediary that bridges the gap between the memory device's narrow optimal temperature range and the broader extreme environmental conditions. This mediator handles the complexity of temperature range adaptation, allowing the core memory device to maintain manufacturing precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If performance is maintained at extreme temperatures, then productivity is improved, but use of energy worsens due to additional temperature adjustment operations

Engineering Contradiction:
Improvedevice productivityVSAvoidenergy consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The temperature adjust module operates with feedback control, continuously monitoring the electronic device's temperature and adjusting thermal energy input or removal accordingly. This feedback mechanism ensures energy is used only when necessary to maintain performance, rather than continuous operation regardless of thermal conditions.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

Temperature adjustment occurs periodically or on-demand based on thermal conditions rather than continuously. The system activates temperature control operations only when temperature thresholds are approached, allowing the device to operate naturally within acceptable ranges and reducing overall energy consumption while maintaining productivity.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively maintains the electronic device's temperature within a stable range, enhancing performance, reducing the risk of shutdowns and data loss, and allowing for more design flexibility and faster development cycles.

Implementation Method 1

The temperature adjust module can include a phase change material or a photochromic material

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

The temperature adjust module can include a phase change material or a photochromic material

Methodology Applied
Scientific EffectPhotochromism: Photochromism

Implementation Method 3

by utilizing solar energy, to maintain the device within a specific optimal temperature range

Methodology Applied
Scientific EffectSolar energy conversion: Solar Energy

Implementation Method 4

This module detects the device's temperature and adjusts it through endothermic or exothermic reactions

Methodology Applied
Scientific EffectEndothermic reaction: Endothermic Reaction

Implementation Method 5

This module detects the device's temperature and adjusts it through endothermic or exothermic reactions

Methodology Applied
Scientific EffectExothermic reaction: Exothermic Reaction

Data Source

PatentUS20250098126A1Device temperature adjustment
Publication Date: 2025.03.20 MICRON TECHNOLOGY INC
  • US20250098126A1 patent drawing
  • US20250098126A1 patent drawing
  • US20250098126A1 patent drawing

AI summary

Systems associated with device temperature adjustment are described. A device temperature adjustment system can include an electronic device having a temperature sensor integrated therein to detect a temperature of the electronic device and a temperature adjust module coupled to the electronic device to adjust a temperature of the electronic device based on the detected temperature.