Thermal Sensor Calibration Using Diode Array and Metal Heater
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Solution Overview
Problem
Current methods for characterizing integrated circuit performance under temperature variation are hindered by inaccurate thermal readings from thermocouples, lengthy stabilization periods, and probe contact issues, leading to inefficiencies in throughput and temperature determination accuracy.
Innovation Solution
A test system utilizing a diode array and metal heater to calibrate thermal sensors at room temperature, allowing for faster temperature settings without lifting probes, reducing contact time, and enabling flexible re-testing with improved temperature accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If thermocouples are used for temperature measurement, then temperature readings can be obtained, but the readings are inaccurate and require lengthy stabilization periods
Solution Approach 1:
The patent introduces an intermediary calibration process using a thermal sensor and known temperature references to bridge the gap between the thermocouple measurements and actual temperatures. This calibration sensor acts as a mediator that provides accurate temperature data without requiring lengthy stabilization periods, thereby resolving the contradiction between measurement accuracy and time consumption.
Solution Approach 2:
The patent applies preliminary calibration action by pre-calibrating the thermal sensor against known temperature references before actual measurements are taken. This preliminary calibration establishes accurate temperature mapping relationships in advance, eliminating the need for lengthy stabilization periods during subsequent measurements while maintaining high accuracy.
2Adaptability or versatility
If temperature-changing equipment is used, then temperature variation characterization can be performed, but the equipment complexity increases and throughput decreases
Solution Approach 1:
The patent enables the measurement system to perform temperature variation characterization using the device under test itself as the temperature reference. The DUT's known temperature characteristics are utilized to calibrate and validate the thermal sensor, eliminating the need for external temperature-changing equipment while maintaining the capability to characterize temperature variation effects on circuit performance.
Solution Approach 2:
The thermal sensor serves multiple functions: it acts as both the measurement device and the calibration reference when paired with the device under test. This multi-functionality eliminates the need for separate temperature-changing equipment, reducing device complexity while preserving the ability to characterize temperature variation effects.
3Measurement precision
If probes are used for electrical contact, then measurements can be taken, but contact time increases and re-testing flexibility is reduced
Solution Approach 1:
The patent performs preliminary calibration and validation of the measurement system before actual testing begins. By establishing the measurement accuracy and thermal sensor calibration in advance using the device under test's known characteristics, the need for prolonged probe contact during re-testing is eliminated, allowing faster measurements while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature accuracy and reduces testing time, improving the characterization of integrated circuit performance by eliminating the need for temperature-changing equipment and minimizing probe contact issues.
Implementation Method 1
extracting an incremental voltage to temperature curve for a diode array from a first incremental voltage of the diode array at a first temperature
Implementation Method 2
heating the diode array and a device under test
Data Source
AI summary
A method of calibrating a thermal sensor device is provided. The method includes extracting an incremental voltage to temperature curve for a diode array from a first incremental voltage of the diode array at a first temperature. The diode array and a device under test (DUT) which includes a thermal sensor are heated. After heating the diode array, a first incremental temperature is determined from the incremental voltage to temperature curve for the diode array and a second incremental voltage of the diode array after heating the diode array. An incremental voltage to temperature curve is extracted for the DUT from the first incremental temperature, a first incremental voltage for the DUT at the first temperature, and a second incremental voltage of the DUT after heating the device under test. A temperature error for the thermal sensor is determined from the incremental voltage to temperature curve for the DUT.