Thermal Image Sensor Floating Support Arms Thermal Isolation
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Solution Overview
Problem
Existing thermal image sensors face a challenge in maintaining high temperature sensitivity due to excessive heat conduction through the support structure, which reduces the absorption of heat energy by the absorption layer.
Innovation Solution
A thermal image sensor with a floating support structure featuring concave-convex shaped supporting arms with conductive layers, which minimize heat conduction and maximize thermal isolation, allowing the multi-layer stack to float above the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a support structure is used to hold the multi-layer stack above the substrate, then thermal isolation is achieved, but heat conduction through the support reduces temperature sensitivity
Solution Approach 1:
The support structure is segmented into multiple supporting arms extending from diagonal corners of the multi-layer stack. This segmentation distributes the mechanical support function across multiple discrete elements, allowing each arm to be optimized for minimal heat conduction while collectively providing sufficient structural support to maintain thermal isolation between the absorption layer and substrate.
Solution Approach 2:
The supporting arms incorporate conductive layers with specifically engineered properties at critical locations. The conductive layers have tailored thermal conductivity, thickness, and pattern (including concave-convex shapes with valley and peak portions) to minimize heat conduction pathways from the substrate to the absorption layer, thereby reducing parasitic heat flow while maintaining necessary mechanical support.
2Strength
If the support structure provides structural rigidity, then mechanical stability is maintained, but heat conduction increases and reduces temperature sensitivity
Solution Approach 1:
The supporting arms are constructed as composite structures combining different materials with complementary properties. The conductive layers are formed on the supporting arms using materials that provide both necessary mechanical strength for structural rigidity and controlled thermal conductivity. This composite approach allows the support structure to maintain mechanical stability while minimizing heat conduction through optimized material selection and layer configuration.
Solution Approach 2:
The supporting arms feature concave-convex shapes including multiple valley portions and peak portions rather than straight linear forms. This curvature introduces thermal resistance by creating longer, more tortuous heat conduction pathways while maintaining structural integrity. The undulating profile with valleys closer to the substrate and peaks farther away reduces direct thermal coupling between the substrate and the absorption layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The innovative support structure enhances temperature sensitivity by reducing heat conduction and increasing the absorption area of the thermal image sensor, thereby improving its thermal isolation and sensitivity.
Implementation Method 1
support allowing the multi-layer stack to float above a substrate for thermal isolation
Implementation Method 2
another portion of the heat energy may be released to the substrate through the support. However, if a large amount of heat energy is released through the support, heat energy absorbed by the absorption layer may be reduced
Implementation Method 3
Received light energy having a predetermined wavelength range may be converted by the absorption layer into heat energy
Implementation Method 4
a bolometer-type thermal image sensor may include an absorption layer and a temperature sensor
Data Source
AI summary
A thermal image sensor and a method of manufacturing the same. The thermal image sensor includes: a substrate; a row electrode and a column electrode on the substrate; a multi-layer stack including an absorption layer and a temperature sensor; supporting arms that extend from diagonal corners of the multi-layer stack and that are spaced apart from both sides of the multi-layer stack, wherein the supporting arms have a concave-convex shape including a plurality of concave portions and a plurality of convex portions; and legs protruding from the row electrode and the column electrode, wherein the legs are connected to extended ends of the supporting arms to allow the multi-layer stack to float above the substrate.