Wafer-Level Thermal Sensor Module With Low-Emissivity Spacer
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Solution Overview
Problem
Non-contact thermal sensors face challenges in accurately measuring object temperatures due to interference from infrared radiation emitted by surrounding materials, and manufacturing inefficiencies in producing compact thermal sensor modules for high-volume applications like mobile phones.
Innovation Solution
The development of compact thermal sensing modules using wafer-level fabrication and low-emissivity materials to reduce radiation interference, featuring optics substrates with transparent portions and spacers coated with metals like copper, aluminum, or gold to minimize infrared radiation detection, thereby enhancing measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional materials are used for the spacer and module housing, then manufacturing is simpler and cheaper, but infrared radiation from surrounding parts interferes with temperature measurement accuracy
Solution Approach 1:
The patent applies low-emissivity material specifically to the spacer components that face the sensor's field of view, rather than requiring all module components to be made of specialized materials. This localized application of low-emissivity coating on spacer inner surfaces facing the optical path effectively blocks infrared radiation from surrounding parts while maintaining manufacturing simplicity for other module components.
2Measurement precision
If low-emissivity materials are used to block infrared radiation, then measurement accuracy improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent specifies that the low-emissivity material should have an emissivity of no more than 0.1, transforming the material property parameter to achieve the desired radiation blocking effect. This quantitative specification enables manufacturers to select from various materials (metallic coatings, specific polymers) that meet the emissivity threshold, making the manufacturing process more controllable and less complex.
3Volume of moving object
If the thermal sensor module is made compact for mobile phone integration, then device portability improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces traditional mechanical assembly processes with wafer-level fabrication techniques, where multiple components (optics substrate, spacer, sensor package) are integrated in a single semiconductor manufacturing process. This substitution enables mass production of compact modules with high precision alignment, reducing the need for complex post-assembly adjustments and improving manufacturing scalability for mobile phone integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the accuracy of temperature measurements by reducing interference from ambient infrared radiation and enables the production of miniaturized, high-volume thermal sensor modules suitable for integration into consumer electronics.
Implementation Method 1
Non-contact thermal sensors typically sense infra-red (IR) radiation
Implementation Method 2
The spacer is composed of, or coated with, a low emissivity material having an emissivity of no more than 0.1
Implementation Method 3
at least a portion of the optics substrate is transparent to infra-red radiation
Data Source
AI summary
Compact thermal sensor modules, which in some implementations can be manufactured in wafer-level fabrication processes, include features composed of or coated with a low-emissivity material to reduce or prevent detection by a sensor of radiation emitted by other parts of the module. For example, spacers that separate an optics substrate and a sensor package from one another can be composed of or coated with such a low emissivity material. In some cases, the low emissivity material has an emissivity of no more than 0.1.