Thermal Imaging Sensor Row Controller Segmentation
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Solution Overview
Problem
Microbolometer-based thermal imaging sensors face challenges with high power consumption due to their complex internal structure and the need for a large number of column integrators.
Innovation Solution
The thermal imaging sensor incorporates a pixel array with microbolometers arranged in an M×N matrix, a row controller for selecting and controlling rows, switches at each pixel, and column integrators that read current signals and convert them to voltage signals. This configuration allows for the formation of frames with partially driven pixel arrays, reducing the number of column integrators needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a microbolometer-based thermal imaging sensor uses a complex internal structure with multiple column integrators to process measured values from all pixels, then measurement precision and image quality are improved, but power consumption increases significantly
Solution Approach 1:
The patent divides the pixel array into multiple blocks and processes only selected blocks (e.g., every other block) in each frame using column integrators. This segmentation approach reduces the number of active column integrators at any given time, thereby reducing power consumption while maintaining thermal image quality through selective high-precision processing of representative blocks.
Solution Approach 2:
Instead of processing all pixel blocks with full precision in every frame, the patent applies partial action by selectively processing only certain blocks with high precision while other blocks are handled with reduced precision or skipped. This partial processing approach maintains acceptable image quality while significantly reducing the power consumption associated with running all column integrators continuously.
2Measurement precision
If column integrators are individually disposed for each column to ensure complete pixel readout, then measurement precision is maintained, but device complexity and power consumption increase
Solution Approach 1:
The patent segments the pixel array into multiple blocks and correspondingly segments the column integrator usage. Instead of requiring individual column integrators for every column in every frame, the system segments the processing task across multiple frames, using a reduced set of column integrators for each segment. This reduces device complexity while maintaining complete pixel readout capability across all blocks over time.
Solution Approach 2:
The patent makes column integrators multi-functional by having them serve multiple columns across different time periods. A single column integrator processes data from multiple different column groups in different frames, making the integrator universal in its function. This reduces the total number of column integrators needed while ensuring all pixels are eventually read out with appropriate precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces power consumption and heat generation during readout, enabling the capture of thermal images with minimal resolution degradation, suitable for electronic devices like smartphones.
Implementation Method 1
Thermal imaging sensors convert light incoming from a predetermined wavelength band into thermal energy and output it to generate image data
Implementation Method 2
In an uncooled microbolometer-based thermal imaging sensor, microbolometers corresponding to resistance are included in pixels
Implementation Method 3
a plurality of column integrators configured to read a current signal from the pixel array obtained through a pixel output line and convert it into a voltage signal
Implementation Method 4
a plurality of analog-to-digital converters (ADCs) configured to convert the voltage signal into a digital voltage signal and output digitally converted pixel data
Data Source
AI summary
A thermal imaging sensor may include: a pixel array in which pixels with microbolometers are arranged in an M×N matrix, where M and N are integers greater than or equal to 2; a row controller configured to output a row control signal through one or more row control signal lines to select and control a predetermined row from among multiple rows; switches connected to the one or more row control signal lines and disposed at each pixel; and a plurality of column integrators configured to read a current signal from the pixel array obtained through a pixel output line and convert it into a voltage signal.