Thermal Image Sensor Support Structure for Higher Temperature Rise
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Solution Overview
Problem
Existing thermal type sensors face challenges in maximizing the temperature rise of the absorption layer due to high thermal conductivity, limiting sensor performance.
Innovation Solution
A thermal image sensor design featuring a composite layer with a pattern of holes and a support structure that increases thermal resistance and directs thermal conduction, incorporating a magnetoresistive element and a reflective layer to enhance infrared absorption and temperature sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the support length is increased to reduce thermal conductivity, then thermal resistance increases and temperature rise range improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The support structure is segmented into multiple sections with varying thicknesses. The first support section has a first thickness and the second support section has a second thickness greater than the first thickness, creating a stepped configuration that reduces thermal conductivity without requiring excessive overall length
Solution Approach 2:
Different sections of the support structure have different thermal properties. The thinner first support section allows some thermal conduction while the thicker second support section provides enhanced thermal insulation, creating localized thermal management zones within the support structure
2Reliability
If the support thickness is increased to reduce thermal conductivity, then thermal resistance increases and sensor performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The support is divided into two distinct sections with different thicknesses, where the first support section has a first thickness and the second support section has a second thickness. This segmentation allows each section to be optimized independently for its specific function while maintaining manufacturability
Solution Approach 2:
Instead of uniformly increasing the thickness of the entire support structure, the invention applies increased thickness only to the second support section where additional thermal insulation is most beneficial, while keeping the first support section thinner to maintain manufacturability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal resistance, increases attainable temperature, and improves sensor performance by limiting thermal conduction direction, thereby increasing the range of temperature rise and sensitivity to infrared radiation.
Implementation Method 1
an absorption layer and a sensor array layer arranged below the absorption layer
Implementation Method 2
Each temperature sensing cell of the plurality of temperature sensing cells may include a magnetoresistive element
Implementation Method 3
a support separating the substrate from the composite layer... the pattern may be configured to increase a thermal resistance of the absorption layer
Data Source
AI summary
A thermal image sensor includes a substrate; a composite layer including an absorption layer and a sensor array layer provided below the absorption layer, the sensor array layer including a plurality of temperature sensing cells, the composite layer having a pattern formed therein, and the pattern including at least one hole penetrating through the absorption layer; and a support separating the substrate from the composite layer.