Thermal Sensor Tube Ribs Reduce Heat Conduction

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Solution Overview

Problem

Conventional thermal sensor assemblies face challenges in achieving a robust mechanical connection while minimizing thermal conductivity between the sensor tube and housing, which affects durability and temperature measurement accuracy.

Innovation Solution

The implementation of raised ribs on the sensor tube to create an interference fit with the housing bore, reducing the total surface area contact and thus thermal conductivity, while maintaining a rigid mechanical connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the sensor tube is rigidly connected to the sensor housing using welding or machining, then the mechanical connection strength is improved, but the thermal conductivity from the sensor tube to the housing increases

Engineering Contradiction:
Improvemechanical connection strengthVSAvoidthermal conductivity
Core Design Contradiction:
StrengthVSLoss of energy

Solution Approach 1:

The connection interface between the sensor tube and housing is segmented into multiple discrete contact points (protrusions contacting recesses) rather than a continuous contact surface. This segmentation maintains mechanical strength through multiple load-bearing points while reducing overall thermal conduction path area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connection structure uses localized protrusions and recesses at specific positions around the circumference, creating areas of high mechanical strength (at contact points) and areas of low thermal conduction (between contact points). This local differentiation allows simultaneous optimization of both mechanical and thermal properties.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If the sensor tube is press-fitted into the housing with full surface contact, then the mechanical connection stability is improved, but the thermal conductivity from the sensor tube to the housing increases

Engineering Contradiction:
Improvemechanical connection stabilityVSAvoidthermal conductivity
Core Design Contradiction:
Stability of the object's compositionVSLoss of energy

Solution Approach 1:

The continuous contact surface is replaced with discrete segmented contact points formed by protrusions and recesses. This provides sufficient mechanical stability through distributed contact points while creating thermal barriers in the non-contact regions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protrusion-recess structure acts as an intermediary mechanical feature that enables stable connection without full surface contact. The geometry of these intermediaries provides both mechanical interlocking and thermal isolation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides a durable and accurate thermal sensor assembly with reduced thermal conductivity, ensuring precise temperature measurements and enhanced mechanical stability.

Implementation Method 1

The raised ribs are configured to provide an interference fit between the sensor tube and the housing

Methodology Applied
Scientific EffectInterference fit: Friction

Implementation Method 2

reducing the total surface area contact and thus thermal conductivity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8545096B2Thermal sensor device and method of assembly
Publication Date: 2013.10.01 AMPHENOL THERMOMETRICS INC
  • US8545096B2 patent drawing
  • US8545096B2 patent drawing
  • US8545096B2 patent drawing

AI summary

A thermal sensor having a robust mechanical connection between a thermal sensor housing and thermal sensor tube is provided having a cross-sectional shape configured to provide a reduced thermal conductivity between the sensor and the housing.