Laminated Thermal Conductive Sheet With VUV-Bonded Flexible Layers
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Solution Overview
Problem
Conventional methods for producing heat-conducting sheets using silicone resin as a matrix face challenges in achieving high flexibility due to weak adhesive forces between primary sheets, leading to exfoliation and increased hardness when using adhesives or semi-cured compression bonding.
Innovation Solution
A heat-conducting sheet comprising multiple unit layers of silicone resin with anisotropic and non-anisotropic fillers, where the sheets are adhered using vacuum ultraviolet (VUV) irradiation to enhance adhesion without additional materials, resulting in a compression ratio of 20-65% for improved flexibility and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive agents or primers are used to enhance adhesion between primary sheets, then adhesion strength is improved, but the heat-conducting sheet becomes hard and loses flexibility
Solution Approach 1:
The patent uses a silane coupling agent as an intermediary substance that chemically bonds to both the silicone resin and the filler particles. This coupling agent enhances the adhesion between primary sheets through chemical bonding mechanisms while maintaining flexibility because it forms a molecular-level bridge rather than requiring thick adhesive layers that would stiffen the structure.
Solution Approach 2:
The patent modifies the chemical parameters of the silicone resin system by incorporating specific silane-modified silicone resins and controlling the curing conditions. By changing the chemical composition parameters (using silane-modified resins with specific functional groups) and curing parameters (temperature, humidity control), the patent achieves strong adhesion while preserving the inherent flexibility of the silicone matrix.
2Temperature
If multiple unit layers are laminated to improve thermal conduction, then thermal conductivity is improved, but adhesion between layers deteriorates due to weak adhesive force
Solution Approach 1:
The patent creates a composite material system combining silane-modified silicone resin, conventional silicone resin, and heat-conducting fillers (such as aluminum oxide, aluminum nitride, or boron nitride). This composite structure provides multiple heat conduction pathways through the filler particles while the silane-modified resin matrix ensures strong adhesion between layers, resolving the contradiction between thermal conductivity and adhesion strength.
Solution Approach 2:
The silane-modified silicone resin acts as an intermediary material that simultaneously provides thermal conduction pathways and strong interlayer adhesion. The silane functional groups create chemical bonds across layer interfaces while the silicone resin matrix and embedded fillers provide thermal conduction, making this intermediary material serve dual functions that resolve the contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach enables the production of heat-conducting sheets with enhanced flexibility and thermal conductivity, preventing exfoliation and maintaining necessary compression ratios for effective heat dissipation in electronic devices.
Implementation Method 1
a step of irradiating at least one surface of the primary sheet with vacuum ultraviolet rays
Data Source
Figure 1
Figure 2(a)~2(c)
Figure 3
AI summary
A heat-conducting sheet (10) has a plurality of unit layers (13) each containing a silicone resin (11) wherein the plurality of unit layers (13) are laminated so as to be adhered with each other, wherein among the plurality of unit layers (13), at least one thereof contains a heat-conducting filler, and the compression ratio of the heat-conducting sheet when being compressed at 0.276 MPa is 20 to 65%.