Thermal Shock Peeling for Electronic Device Transfer
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Solution Overview
Problem
Existing methods for manufacturing electronic devices often result in damage and deformation during the peeling process, particularly due to solution flow or laser-induced damage, and are not suitable for producing large-area electronic devices with complex shapes.
Innovation Solution
A method involving the formation of a stack structure with a to-be-peeled layer on a substrate, application of thermal shock by heating and immediate cooling to generate thermal stresses, and transfer of the peeled layer to a target substrate using a transfer layer, which includes materials like polydimethyl siloxane or heat-peeling tape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic device is peeled off from the transfer substrate using conventional methods, then the electronic device can be transferred to the target, but the electronic device may be damaged by solution flow or laser
Solution Approach 1:
The patent replaces chemical solution-based peeling with a mechanical peeling method. A peeling layer is formed between the electronic device and transfer substrate, and mechanical force is applied to separate them. This eliminates the harmful effects of solution flow on the electronic device while achieving effective transfer.
Solution Approach 2:
The patent introduces a peeling layer as an intermediary substance between the electronic device and the transfer substrate. This peeling layer facilitates the separation process by providing a controlled interface for mechanical peeling, preventing direct contact between harmful solutions and the electronic device.
2Manufacturing precision
If conventional peeling methods are used, then the electronic device can be transferred, but the arrangement may differ from initial arrangement due to solution flow
Solution Approach 1:
The patent replaces solution-based peeling with mechanical peeling using a peeling layer. This mechanical approach eliminates fluid dynamics that cause distortion, ensuring the electronic device maintains its initial arrangement during the transfer process.
Solution Approach 2:
The patent changes the peeling mechanism from chemical solution interaction to mechanical separation. By altering the fundamental parameter of how peeling is achieved (from solution flow to mechanical force), the arrangement accuracy is preserved while avoiding solution-induced distortion.
3Ease of manufacture
If thermal shock is applied to generate thermal stresses for peeling, then the to-be-peeled layer can be detached from the substrate, but the process requires precise temperature control
Solution Approach 1:
The patent utilizes thermal expansion differences between the substrate and the to-be-peeled layer. By applying thermal shock, the differential expansion generates thermal stresses that facilitate peeling. This leverages a natural physical phenomenon to achieve efficient detachment.
Solution Approach 2:
The patent employs phase transition of materials involved in the stack structure during thermal shock. The rapid heating and cooling causes phase changes that generate internal stresses, enabling the to-be-peeled layer to detach from the substrate through controlled thermal cycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces damage and distortion, allows for the production of large-area electronic devices with complex shapes without the need for additional layers or chemical solutions, and shortens the peeling time, making it more efficient and cost-effective.
Implementation Method 1
applying thermal shock to the stack structure
Implementation Method 2
generating thermal stresses in opposite directions in the substrate and the to-be-peeled layer
Data Source
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AI summary
A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.