Thermal Shutdown Circuit With Integrated Test Isolation

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Solution Overview

Problem

Existing semiconductor devices lack effective mechanisms to protect peripheral devices from excessive temperature increases by stopping power supply in a controlled manner, and existing test circuits for determining normal power stoppage are inefficient.

Innovation Solution

A semiconductor device with an integrated excessive temperature detection circuit and test circuit that includes a power supply circuit, excessive temperature detection circuit, and test circuit, utilizing elements like MOSFETs, diodes, and operational amplifiers to detect and respond to temperature thresholds, ensuring controlled power supply interruption and insulation between terminals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a test circuit is added to determine whether power supply has been stopped normally, then the reliability of power supply control is improved, but the device complexity increases

Engineering Contradiction:
Improvepower supply control reliabilityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the excessive temperature detection circuit and the test circuit into a single integrated structure. The test circuit shares common components (such as the operational amplifier and voltage reference) with the excessive temperature detection circuit, thereby reducing overall device complexity while maintaining the ability to determine whether power supply has been stopped normally.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The operational amplifier and voltage reference circuit serve dual purposes: they are used both for excessive temperature detection and for testing whether power supply has been stopped normally. This multi-functionality reduces the need for separate dedicated components, thereby improving reliability without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If electrical insulation is provided between test circuit and excessive temperature detection circuit, then the measurement precision is improved, but the device complexity increases

Engineering Contradiction:
Improvetemperature detection precisionVSAvoidcircuit isolation complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent employs dynamic electrical insulation that is activated only during normal operation (when power supply needs to be stopped). During test operations, the insulation is temporarily removed to allow the test circuit to function. This dynamic approach ensures measurement precision during normal operation without requiring permanent complex isolation structures.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The test circuit performs preliminary testing to determine whether power supply has been stopped normally before the excessive temperature detection circuit begins its monitoring function. This preliminary action ensures that the insulation mechanism is properly initialized and will function correctly when needed, maintaining measurement precision without requiring complex continuous isolation.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12401185B2Semiconductor device
Publication Date: 2025.08.26 KK TOSHIBA
  • US12401185B2 patent drawing
  • US12401185B2 patent drawing
  • US12401185B2 patent drawing

AI summary

According to one embodiment, a semiconductor device includes, a first terminal, a second terminal, a third terminal, a first circuit configured to output a first signal of a first level if a temperature satisfies a condition, and a second circuit configured, if the first circuit outputs the first signal of the first level, to provide electrical insulation between the second terminal and the third terminal, wherein the first circuit includes an element provided between a first interconnect and the first terminal, and the first circuit outputs the first signal of the first level regardless of the temperature if a first voltage is supplied to the first interconnect.