Thermal Skeleton Embedded Chassis for Heat Dissipation

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Solution Overview

Problem

Current thermal management systems face limitations in processing power and functionality due to thermal spreading resistance, which leads to overheating and reduced lifespan in electronic devices, especially in constrained size and weight environments like avionics systems.

Innovation Solution

A thermal management system with a chassis frame optimized by replacing metallic structures with lighter materials and embedding thermal skeletons containing a working fluid to enhance heat dissipation, using additive manufacturing techniques for improved thermal conduction paths and reduced thermal gradients.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling methods (fans, heat sinks) are used, then heat dissipation is achieved, but system weight and volume increase, limiting processing power

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidsystem weight

Core Design Contradiction:

TemperatureVSWeight of stationary object

Solution Approach 1:

The thermal skeleton is embedded within the chassis body structure, nesting the thermal management function inside the existing structural framework. This eliminates separate cooling components and reduces overall system weight while maintaining effective heat dissipation through the integrated thermal conduction paths.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The chassis body combines lightweight substitute materials with thermal skeleton structures to create a composite thermal management system. This composite approach achieves effective heat dissipation without the weight penalty of conventional metallic cooling systems, as the lightweight materials are strategically positioned to maximize thermal conduction where needed.

Inventive Principle:

Principle #40Composite materials

2Productivity

If processor density is increased to improve computing power, then processing capability increases, but thermal spreading resistance causes overheating

Engineering Contradiction:

Improveprocessing powerVSAvoidthermal spreading resistance

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The thermal skeleton is strategically positioned and configured to provide localized thermal conduction paths at specific hot spots and high-density processor regions. This local quality approach ensures that thermal management is optimized precisely where processing power is concentrated, enabling higher processor density without overheating by addressing thermal spreading resistance at the critical locations.

Inventive Principle:

Principle #3Local quality

3Weight of stationary object

If metallic structure is replaced with lighter materials, then system weight decreases, but thermal conduction capability is reduced

Engineering Contradiction:

Improvechassis weightVSAvoidthermal conduction

Core Design Contradiction:

Weight of stationary objectVSTemperature

Solution Approach 1:

The chassis body uses composite construction combining lightweight substitute materials with embedded thermal skeleton structures. The lightweight materials reduce overall weight while the thermal skeleton components (made of thermally conductive materials) are strategically positioned to maintain effective thermal conduction paths, thus achieving weight reduction without sacrificing thermal management capability.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The thermal skeleton is nested within the lightweight chassis body structure, creating an integrated system where the lightweight material provides structural support and the embedded thermal skeleton provides thermal conduction. This nesting approach allows the lightweight material to be used extensively for weight reduction while the thermal skeleton ensures adequate heat dissipation through its conductive paths.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces thermal spreading resistance, allowing for increased processing power and functionality while maintaining or reducing system weight, and effectively dissipates heat through enhanced thermal conduction paths and two-phase heat transfer mechanisms.

Implementation Method 1

providing a thermal conduction path for heat dissipating from the chassis body

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a working fluid contained within the thermal skeleton and used to further dissipate the heat from the chassis body

Methodology Applied

Scientific EffectTwo-phase heat transfer: Two-Phase Flow

Implementation Method 3

a heat sink thermally coupled to the system and configured to further dissipate the heat from the working fluid

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS10136557B2Thermal management systems and methods for heat generating electronics

Publication Date: 2018.11.20 GENERAL ELECTRIC CO

AI summary

According to one embodiment, a thermal management system is provided that includes at least one chassis frame configured to minimize a thermal spreading resistance of the thermal management system. The chassis frame included at least one chassis body, at least one thermal skeleton embedded into the chassis body, and a working fluid contained within the thermal skeleton and used to dissipate heat from the chassis body.