Thermal Spray Conductor Tracks Using Composite Core-Shell Particles
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Solution Overview
Problem
Thermal spraying of conductor tracks comprising copper for electronic modules requires high process temperatures, which can degrade insulating layers and damage semiconductor components.
Innovation Solution
Combining a first metallic material with a second material having a lower melting point, such as tin or aluminum, to reduce thermal stress and achieve interdiffusion at lower temperatures, thereby forming strong and conductive intermetallic phases without damaging the module's constituents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high process temperatures are used for thermal spraying of copper conductor tracks, then electrical conductivity is improved, but insulating layers are degraded and semiconductor components are damaged
Solution Approach 1:
The patent uses composite particles consisting of a copper core and a tin shell. The tin layer has a lower melting point than copper, allowing the thermal spraying process to occur at reduced temperatures that protect the insulating layer and semiconductor components while still achieving satisfactory electrical conductivity through the copper core.
Solution Approach 2:
The patent changes the material parameters by introducing a second metallic material (tin) with different thermal properties (lower melting point) than the first material (copper). This parameter change enables the thermal spraying process to be conducted at lower temperatures, resolving the contradiction between achieving good conductivity and avoiding thermal damage.
2Reliability
If copper particles are used for conductor tracks, then electrical conductivity is achieved, but high melting point requires high process temperatures that damage the substrate
Solution Approach 1:
The patent creates composite particles with a copper core (providing electrical conductivity) and a tin shell (providing lower melting point). This composite structure allows the material to exhibit properties of both components: high electrical conductivity from copper and low processing temperature from tin.
Solution Approach 2:
The tin shell acts as an intermediary material that mediates between the copper core and the thermal spraying process. The tin layer melts at lower temperature, enabling the copper particles to be deposited without requiring high process temperatures that would damage the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the manufacture of thermally stable and high-conductivity conductor tracks with reduced thermal stress on the insulating layers, enabling the use of a variety of insulation materials and preventing damage to semiconductor components, while maintaining high electrical conductivity.
Implementation Method 1
the first material (40) and the second material (50) are interdiffused, in particular alloyed and/or mixed, with one another
Implementation Method 2
thermal spraying of conductor tracks comprising copper or another metallic material
Data Source
AI summary
A method for fabricating a conductor track, the method comprising:applying a first metallic and electrically conductive material to form the conductor track; andspraying a second metallic material on the conductor track; wherein the second metallic material has a lower melting point than the first material.