Thermal-Sprayed Heater Layout Without Through-Hole Power Feed
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Solution Overview
Problem
Conventional heater components in semiconductor manufacturing apparatuses experience temperature non-uniformity and strength reduction due to through holes for power supply, leading to stress concentration and damage around the power supplying points.
Innovation Solution
A heater component with a thin coating heater formed of thermal sprayed coating, where the heater body and extension part are positioned outside the substrate, allowing for continuous and uniform power supply without through holes, thereby preventing temperature singularities and maintaining durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a through hole is equipped in the substrate and a power supplying member is connected from the lower surface of the heater, then power can be supplied to the heater, but temperature uniformity in the heater area is impaired due to temperature singularities at the contact points
Solution Approach 1:
The invention extracts the power supplying member from the substrate interior by forming the heater as an extended structure that protrudes from the substrate surface. The power supplying member is connected to the extended part of the heater rather than penetrating through the substrate, thereby removing the through-hole structure that caused temperature singularities while maintaining power supply functionality.
Solution Approach 2:
The invention transitions from a conventional through-hole power supply approach (vertical dimension through substrate) to an extended heater structure approach (horizontal extension from substrate surface). By forming the heater to extend from the substrate and connect the power supplying member to this extended portion, the power supply connection is relocated to a different spatial dimension, eliminating temperature singularities in the heater area.
2Reliability
If a through hole is equipped in the substrate for power supply, then electrical connection can be established, but stress concentration and damage occur around the through hole due to thermal expansion differences
Solution Approach 1:
The invention removes the through-hole structure from the substrate by extracting the power supply connection path from the substrate interior. Instead of penetrating through the substrate, the heater is formed to extend from the substrate surface, and the power supplying member connects to this extended portion, thereby eliminating stress concentration points while maintaining electrical connection reliability.
3Power
If conventional heater structure with through holes is used, then power supply is achieved, but durability is reduced due to temperature singularities and stress concentration
Solution Approach 1:
The invention extracts the power supply connection from the substrate interior and relocates it to the extended heater structure. By forming the heater to protrude from the substrate and connecting the power supplying member to this extended portion, the harmful through-hole structure is eliminated, preventing both temperature singularities and stress concentration, thereby improving durability while maintaining power supply capability.
Solution Approach 2:
The invention changes the spatial arrangement of the power supply connection from a through-substrate vertical path to a horizontal extension from the substrate surface. This dimensional change relocates the connection point away from the heater area, eliminating the sources of temperature singularities and stress concentration that reduced durability, while preserving full power supply functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved temperature uniformity and maintains the strength of the heater component during heat generation, preventing damage and ensuring consistent performance.
Implementation Method 1
a thin coating heater which is equipped outside the substrate part and generates heat by power supply
Implementation Method 2
The thin coating heater is formed of a thermal sprayed coating
Data Source
AI summary
A heater component has a substrate part and a thin coating heater which is equipped outside this substrate part and generates heat by power supply. The thin coating heater is formed of a thermal sprayed coating. The thin coating heater has a heater body and a heater extension part. The heater body is arranged on a first end face of the substrate part. The heater extension part is extended from the heater body to a second end face of the substrate part through a side surface of the substrate part. A tip part of the heater extension part is a heater power supplying part for supplying electric power to the heater body.