Thermal Spreader Layer in Hinge for Foldable Device Cooling
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Solution Overview
Problem
Configurable housing assemblies in communication devices, such as smartphones and tablets, limit thermal spreading due to non-conductive hinge mechanisms, leading to reduced operational functionality and increased risk of overheating from heat-generating components.
Innovation Solution
Incorporating thermal spreader layers that extend through the hinge assembly, thermally coupled to both device housings, to create a thermal gradient and enhance heat dissipation by transferring thermal energy between the housings, thereby reducing localized hot spots and utilizing a battery as a heat sink for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a hinge mechanism is used to connect two housings in a configurable housing assembly, then the device achieves mobility and compact form factor, but thermal energy transfer between housings is limited or prevented
Solution Approach 1:
A flexible thermal spreader layer is introduced as an intermediary component that extends through the hinge mechanism, thermally coupling the first and second housings while allowing mechanical movement. This mediator enables thermal energy transfer across the hinge without compromising the configurable housing's mobility.
Solution Approach 2:
The thermal spreader utilizes a composite structure combining flexible materials with high thermal conductivity, allowing it to both transmit heat effectively and accommodate the mechanical deformation required by the hinge's movement between different device configurations.
2Productivity
If heat-generating components operate at high clock speeds, then computational performance is improved, but thermal energy dissipation becomes insufficient leading to overheating
Solution Approach 1:
The thermal management solution extends thermal pathways into a new dimension by routing the flexible thermal spreader layer through the hinge mechanism to the opposite housing, creating additional thermal dissipation pathways that were not available in traditional single-housing designs.
Solution Approach 2:
The flexible thermal spreader layer serves multiple functions: it provides thermal coupling between housings, accommodates mechanical movement of the hinge, and distributes thermal energy across a larger surface area, thereby enhancing overall heat dissipation capacity.
3Temperature
If thermal spreader layers are added to extend through the hinge assembly, then thermal spreading is enhanced, but device complexity increases
Solution Approach 1:
The thermal spreader is implemented as a flexible thin film or layer that can be integrated into the existing hinge structure. This flexible membrane approach adds minimal structural complexity while effectively conducting thermal energy across the movable joint between housings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates thermal energy across the device, maintaining component operational temperatures and improving the overall functionality and reliability of communication devices by enhancing thermal spreading and dissipation within the configurable housing.
Implementation Method 1
a thermal spreader layer extending through a hinge assembly coupling the first device housing to the second device housing... The thermal spreader layer transfers thermal energy from a first location within the first device housing to a second location within the second device housing
Implementation Method 2
utilizing a battery as a heat sink for effective cooling
Data Source
AI summary
An electronic device with a configurable housing assembly and a method enhances thermal energy spreading within the device via thermal spreader layer(s) of a flexible layer assembly extending through a channel defined in a hinge assembly of the device. The hinge assembly has a hinge body coupling first and second device housings of the configurable housing assembly. Purlin(s) of the hinge assembly support a back flexible display. A thermal spreader layer is positioned on a surface of a flexible circuit of the flexible layer assembly. The thermal spreader layer has one end thermally coupled within the first device housing and another end thermally coupled within the second device housing to transfer thermal energy between the first and the second structures. The flexible layer assembly deforms within the channel when the first and second device housings pivot about the hinge body from a closed position to an axially displaced open position.