3D Thermal Spreading in Air-Cooled Devices
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Solution Overview
Problem
Existing thermal management devices for electronic components fail to adequately address increased heat fluxes, limited convective air flow, reduced heating surfaces, and colder junction temperatures, especially in confined spaces with intensive heat generating components.
Innovation Solution
A thermal management device comprising a chamber with a first evaporation section and a first condensation portion, coupled with a heat dissipating structure and at least one heat pipe, utilizing an energy-activated multilayer foil solder material and a finned heat dissipation space to enhance heat transfer through evaporation and condensation cycles, and heat pipes to bypass thermal resistance and increase efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat sinks with conductive adhesive are used, then heat transfer from the component surface is achieved, but thermal resistance at the interface limits heat flux removal efficiency
Solution Approach 1:
The patent employs phase change material (paraffin wax) that transitions from solid to liquid state when absorbing heat from the electronic component. This phase transition occurs at a specific temperature range, enabling the material to absorb large amounts of heat energy during melting while maintaining a relatively constant temperature, thereby efficiently removing heat flux from the component surface without being limited by conventional conductive adhesive thermal resistance.
Solution Approach 2:
The patent incorporates a capillary wick structure that utilizes capillary action to transport the melted phase change material from the evaporation zone back to the condensation zone. This passive fluid transport mechanism eliminates the need for external pumps or fans, enabling continuous heat removal through the cyclic movement of the phase change material driven by capillary forces.
2Power
If intensive heat generating components are used, then processing power increases, but local hot spots form that reduce component efficiency before critical temperatures are reached
Solution Approach 1:
The patent implements a localized phase change cooling system directly attached to the heat-generating component surface. The phase change material is confined to a specific region beneath the component, providing intensive local cooling exactly where heat is generated. This localized approach addresses hot spots at their source, maintaining component efficiency by preventing temperature rise in critical areas before they reach detrimental levels.
3Volume of moving object
If confined spaces are used for mounting components, then device compactness is achieved, but convective air cooling effectiveness is reduced
Solution Approach 1:
The patent replaces conventional convective air cooling (which requires air flow and space) with a phase change-based cooling system. The phase change material absorbs heat through its latent heat of fusion, eliminating the need for air circulation. This substitution enables effective cooling in confined spaces where air flow is restricted, maintaining device compactness while overcoming the limitations of convective cooling.
4Ease of manufacture
If vapor chamber geometry is simplified to flat rectangular shapes, then manufacturing is easier, but thermal spreading efficiency is reduced
Solution Approach 1:
The patent transitions from conventional two-dimensional flat vapor chambers to a three-dimensional structured design with vertical fins and extended surfaces. This dimensional enhancement increases the heat transfer surface area and improves thermal spreading efficiency by distributing heat more effectively through the phase change material and wick structure, while still maintaining manufacturability through additive manufacturing or modular assembly techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the average surface temperature of the fins, bypasses thermal resistance, and enhances the overall efficiency of the thermal management device by increasing the temperature gradient and improving heat dissipation, especially in confined spaces.
Implementation Method 1
The component surface is in contact with a phase change material configured to melt upon contact with the component surface
Implementation Method 2
The fluid absorbs the heat from the surface and evaporates
Implementation Method 3
A wick structure is provided in communication with the phase change material and configured to wick the melted phase change material away from the component surface
Implementation Method 4
the heat from the component is drained to the surrounding air in a forced or natural flow of air
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component (1) from a circuit assembly or any other embodiment where a heat generating component (1) can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe (4) is used to transfer heat from the condensation portion (3) of a vapor chamber (2) to cool a bottom portion of a finned heat dissipation space (6) and transfer the heat to a colder location on the heat fins (5). In another proposed embodiment, the water vapor chamber (2) is placed in a heat sink (102) and is adapted to thermally connect to at least one heat pipe (4).