Compliant Thermal Spring Frame for Sealed Electronics Cooling
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Solution Overview
Problem
Electronic devices in sealed environments face challenges in efficient heat removal due to limited cooling options, which can lead to premature failures and reduced component lifespan, and conventional assembly methods struggle with tolerance issues and costly manufacturing techniques.
Innovation Solution
A compliant thermal spring frame with spring features that flexibly mount and orient printed circuit board assemblies, providing consistent pressure for heat transfer and acting as an EMI/RFI shield, made from metal to cover heat generating components and allow for economical, efficient cooling while accommodating dimensional variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used in sealed environments, then heat removal capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the cooling function from complex active systems and implements it through a simple thermal conduction path using a thermally conductive adhesive layer and heat sink structure integrated into the sealed enclosure, eliminating the need for fans or fluid cooling systems
Solution Approach 2:
The patent introduces a thermally conductive adhesive layer as an intermediary between the electronic component and the heat sink structure, enabling efficient heat transfer while maintaining the sealed environment and simplifying the overall cooling system
2Manufacturing precision
If conventional assembly methods are used, then manufacturing precision is improved, but assembly time and cost increase
Solution Approach 1:
The patent employs a compliant frame structure with spring features that dynamically adapt to dimensional variations in the electronic component, maintaining proper contact pressure without requiring precise pre-assembly tolerances or complex adjustment procedures
Solution Approach 2:
The patent changes the mechanical parameters of the mounting system by using elastic compliance in the frame and adhesive layer, allowing the system to accommodate dimensional variations through elastic deformation rather than requiring tight manufacturing tolerances
3Stability of the object's composition
If rigid mounting structures are used, then structural stability is improved, but thermal contact consistency deteriorates
Solution Approach 1:
The patent combines rigid structural elements (frame) with compliant thermal interface materials (adhesive layer) to achieve both structural stability and consistent thermal contact, allowing the system to maintain reliable heat transfer while supporting the electronic component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat transfer, reduces component stress, and extends device lifespan by ensuring consistent contact between heat-generating elements and cooling surfaces, while also providing electromagnetic interference shielding and resistance to shock and vibration.
Implementation Method 1
A compliant thermal spring frame with spring features that flexibly mount and orient printed circuit board assemblies, providing consistent pressure for heat transfer
Implementation Method 2
made from metal to cover heat generating components and allow for economical, efficient cooling
Implementation Method 3
acting as an EMI/RFI shield, made from metal to cover heat generating components
Data Source
AI summary
A compliant electronics assembly mount frame and package are provided. The compliant frame may include a number of spring features configured to flexibly maintain and/or orient an attached PCBA inside a thermal conduction package. These spring features disposed in the compliant frame may be shaped, sized, and even tuned, to bias heat generating components attached to the PCBA evenly against a thermally controlled surface of the thermal package. The frame may be made or stamped from metal, such as sheet metal, and may be formed to include one or more integral spring features.