Thermal Strap for Image Sensor Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance image sensors produce heat, causing thermal expansion that can shift their position and lead to image distortion or loss of focus, as the surrounding components absorb and expand due to increased heat, disrupting the precise alignment required between the image sensor and optical components.
Innovation Solution
A flexible, thermally conductive thermal strap is used to efficiently remove heat from the image sensor to a heat sink, preventing mechanical and thermal stresses from affecting the alignment of the optical train, while allowing for movement due to thermal or mechanical stresses during device use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high-performance image sensor is used to capture undistorted images, then image quality is improved, but heat generation increases causing thermal expansion and alignment shifts
Solution Approach 1:
The patent separates the thermal management function from the mechanical support structure by introducing a dedicated thermal strap. This segmentation allows the image sensor to be supported mechanically by one structure while thermally coupled to another, enabling independent optimization of mechanical stability and heat dissipation pathways.
Solution Approach 2:
The thermal strap acts as an intermediary component between the image sensor and the thermal sink. It provides a dedicated thermal conduction pathway that transfers heat away from the sensor without being part of the mechanical alignment structure, thus preventing thermal expansion from affecting optical alignment.
2Stability of the object's composition
If rigid mechanical coupling is used to maintain alignment, then positional stability is improved, but thermal expansion causes misalignment
Solution Approach 1:
The patent divides the coupling function into two separate pathways: a mechanical support pathway for positional stability and a thermal conduction pathway for heat removal. This segmentation prevents thermal expansion of the mechanical structure from causing misalignment.
Solution Approach 2:
The thermal strap serves as an intermediary that provides thermal coupling without mechanical constraint. It allows heat to flow from the sensor to the thermal sink while permitting the sensor to maintain its precise optical alignment independent of thermal effects on surrounding structures.
3Temperature
If thermal strap is introduced for heat removal, then temperature control is improved, but device complexity increases
Solution Approach 1:
The thermal strap provides passive thermal management by conducting heat from the image sensor to the thermal sink through natural thermal conduction. This self-service approach eliminates the need for active cooling systems, motors, or complex control mechanisms, thereby adding minimal complexity while effectively managing temperature.
4Device complexity
If heat is allowed to transfer to surrounding components, then thermal management is simplified, but component expansion causes image distortion
Solution Approach 1:
The patent extracts the heat transfer function from the surrounding structural components and concentrates it in a dedicated thermal strap. This extraction prevents heat from being absorbed by mechanical and optical components that would otherwise expand and cause misalignment, while still providing effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the alignment of the image sensor and its optics by reducing temperature differences and preventing misalignment, ensuring undistorted and in-focus images by managing heat transfer separately from mechanical loads.
Implementation Method 1
A flexible, thermally conductive thermal strap is used to efficiently remove heat from the image sensor to a heat sink
Implementation Method 2
efficiently remove heat from the image sensor to a heat sink
Data Source
AI summary
A heat transfer apparatus includes a circuit board assembly and an image sensor including a plurality of photodetectors disposed in a semiconductor material. The image sensor is mounted to the circuit board assembly. A thermal strap with a first end is thermally coupled to transfer heat out of the image sensor. A heat sink is thermally coupled to a second end of the thermal strap opposite the first end of the thermal strap to receive heat from the image sensor.