Flexible Thermal Strap Cooling for Bottom-Side PCB Components

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Solution Overview

Problem

High-power accelerators face challenges in cooling bottom-side electronic components due to limited space and thermal management constraints, particularly with low thermal conductivity of thermal interface materials (TIM) layers and limited z-height on printed circuit boards, which hinder efficient heat dissipation.

Innovation Solution

Implementing flexible thermal straps made of copper or graphite, which replace multiple TIM layers, providing a mechanically robust and thermally efficient path for heat transfer from bottom-side components to a cold plate assembly, allowing for modular cooling solutions that can be easily serviced.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple TIM layers are used to thermally couple bottom-side electronic components to the cold plate, then thermal interface coverage is improved, but thermal conductivity deteriorates due to low thermal conductivity of TIM materials

Engineering Contradiction:

Improvethermal interface coverageVSAvoidheat dissipation efficiency

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The patent changes the material parameter from low thermal conductivity TIM layers to high thermal conductivity copper or graphite thermal straps, fundamentally altering the thermal conduction capability while maintaining interface coverage

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite thermal management structures combining copper or graphite thermal straps with TIM layers, where the high-conductivity strap material compensates for the low-conductivity TIM material, achieving both coverage and efficiency

Inventive Principle:

Principle #40Composite materials

2Temperature

If rigid thermal coupling structures are used to ensure thermal contact, then thermal transfer is improved, but mechanical robustness and flexibility deteriorate

Engineering Contradiction:

Improvethermal transfer efficiencyVSAvoidmechanical robustness

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent replaces rigid thermal coupling structures with flexible thermal straps made of copper or graphite, which can deform to conform to surface irregularities while maintaining thermal contact, thus improving both thermal transfer and mechanical adaptability

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The thermal straps are designed to be mechanically flexible rather than rigid, allowing dynamic adaptation to assembly variations and thermal expansion/contraction, maintaining thermal contact under varying mechanical conditions

Inventive Principle:

Principle #15Dynamics

3Temperature

If fixed thermal management components are used, then thermal performance is optimized, but serviceability and modular flexibility deteriorate

Engineering Contradiction:

Improvethermal performanceVSAvoidserviceability

Core Design Contradiction:

TemperatureVSEase of repair

Solution Approach 1:

The patent divides the thermal management system into modular segments where the cold plate assembly can be independently removed and replaced, with thermal straps designed for easy detachment and reattachment, significantly improving serviceability while maintaining thermal performance

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermal straps are pre-formed and pre-positioned on the module frame, allowing for quick installation and removal of the cold plate assembly without complex assembly procedures, enhancing both serviceability and modular flexibility

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible thermal straps reduce component temperatures by up to 10 degrees Celsius, enabling higher power components on the bottom side of the module and allowing for modular design with improved serviceability and flexibility in cooling solutions.

Implementation Method 1

a flexible thermal strap (256) connecting the top stiffener plate (252) to the slug (236)... providing a mechanically robust and thermally efficient path for heat transfer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12504799B2Flexible and modular top and bottom side processor unit module cooling

Publication Date: 2025.12.23 INTEL CORP

AI summary

Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.