Thermal Strap and TEC Layout for Heat and Vibration Isolation
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Solution Overview
Problem
Existing thermal and vibration isolation systems are incompatible, as mechanical isolation requires relative displacement, which is not feasible with thermally stable chambers that dissipate heat efficiently through rigid metal interfaces, leading to vibration transmission.
Innovation Solution
A system combining a sensor chassis with a thermoelectric cooler, thermal strap, and isolators, where the thermal strap provides mechanical compliance to allow relative displacement for vibration isolation while maintaining thermal regulation by using a thermoelectric cooler and insulating materials like aerogel to dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid metal interface is used to dissipate heat efficiently from a thermally stabilized enclosure, then heat dissipation is improved, but vibrations and/or shocks are transmitted to the payload
Solution Approach 1:
The patent introduces a compliant thermal interface material as an intermediary between the thermally stabilized enclosure and the heat dissipation path. This material allows relative displacement and vibration isolation while maintaining thermal contact, thus mediating between the conflicting requirements of rigid heat transfer and flexible vibration isolation.
Solution Approach 2:
The patent changes the physical parameters of the thermal interface by using materials with specific compliance characteristics. The compliant thermal interface material has modified mechanical properties (increased flexibility) while maintaining adequate thermal conductivity, allowing the system to achieve both heat dissipation and vibration isolation.
2Object-affected harmful factors
If mechanical isolation devices are used to attenuate vibrations, then vibration isolation is improved, but thermal regulation becomes infeasible due to lack of rigid interface
Solution Approach 1:
The patent makes the compliant thermal interface material multi-functional by designing it to simultaneously provide both thermal conduction and mechanical compliance. This single component performs the dual functions of heat dissipation and vibration isolation, eliminating the need for separate mechanical isolation devices that would compromise thermal regulation.
Solution Approach 2:
The patent merges the functions of thermal interface and mechanical isolation into a single compliant thermal interface material. This combination allows the system to achieve both thermal regulation and vibration isolation through one integrated solution rather than requiring separate components.
3Object-affected harmful factors
If relative displacement is allowed for vibration isolation, then vibration attenuation is improved, but thermal contact is compromised
Solution Approach 1:
The patent modifies the mechanical parameters of the thermal interface by using compliant materials that can accommodate relative displacement. These materials maintain adequate thermal contact under varying mechanical conditions, allowing the system to tolerate the relative motion necessary for vibration isolation while preserving thermal conduction pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively isolates vibrations and provides thermal regulation, improving heat dissipation by approximately 5°C compared to systems without a thermal strap, while maintaining equivalent vibration isolation performance.
Implementation Method 1
a thermoelectric cooler between the sensor chassis and the electronics housing
Implementation Method 2
a thermal strap coupled to the sensor chassis... improving heat dissipation by approximately 5°C
Implementation Method 3
at least one isolator coupled to the sensor chassis... effectively isolates vibrations
Implementation Method 4
an insulating material in the interior chamber of the sensor chassis that extends around the electronics housing. The insulating material may be Aerogel
Data Source
Figure 1~2C
Figure 3~4
Figure 5
AI summary
A system configured to provide thermal regulation and vibration isolation to one or more electronic components. The system includes a sensor chassis defining an interior chamber, an electronics housing in the interior chamber of the sensor chassis, a thermoelectric cooler coupled between the sensor chassis and the electronics housing, a thermal strap coupled to the sensor chassis, and at least one isolator coupled to the sensor chassis. The system may also include an insulating material, such as Aerogel, in the interior chamber of the sensor chassis and extending around the electronics housing.